公开(公告)号：US20210329451A1

公开(公告)日：2021-10-21

申请号：US17271453

申请日：2019-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taesoo JUN ,  Saerome KIM ,  Jihoon JUNG

IPC: H04W12/08 ,  H04L12/24 ,  H04W12/06

Abstract: An electronic device according to various embodiments of the present invention comprises a communication module, a processor, and a memory which stores a control list for a plurality of devices controllable through a communication network and which is operably connected to the processor, wherein the memory that are configured, when executed, to cause the processor to perform authentication for a first terminal in response to a control authority configuration request for controlling at least one device of the plurality of devices in a first terminal, transmit authentication information about the first terminal to the at least one device of the plurality of devices included in the control list, and configure a control right of the first terminal for the at least one device. In addition, embodiments other than the various embodiments of the present invention are possible.

公开(公告)号：US20240203946A1

公开(公告)日：2024-06-20

申请号：US18537997

申请日：2023-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junyeong HEO ,  Unbyoung KANG ,  Sera LEE ,  Jihoon JUNG

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/00 ,  H01L23/48 ,  H01L29/06

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L23/481 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L29/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06565 ,  H01L2225/06568

Abstract: A semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. A semiconductor device layer is disposed on the active surface. A modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.

公开(公告)号：US20210258856A1

公开(公告)日：2021-08-19

申请号：US17154224

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Saerome KIM ,  Jiung YU ,  Jihoon JUNG

IPC: H04W48/02 ,  H04W76/10 ,  H04W76/38

Abstract: An electronic apparatus is provided. The electronic apparatus includes: a communication interface comprising circuitry and a processor connected with the communication interface and configured to control the electronic apparatus, wherein the processor is configured to, based on identification information of an access point and access information including an access allowance time to the access point being received from another electronic apparatus through the communication interface, connect communication to the access point based on the identification information of the access point, and based on the access allowance time passing, release access to the access point.

公开(公告)号：US20250029955A1

公开(公告)日：2025-01-23

申请号：US18616418

申请日：2024-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon JUNG ,  UN-BYOUNG KANG ,  YEONGKWON KO ,  KUYOUNG KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H10B80/00

Abstract: A semiconductor package includes: a buffer die; a plurality of memory dies stacked on the buffer die; a mold layer covering a portion of a top surface of the buffer die and lateral surfaces of the plurality of memory dies; and an inorganic layer disposed on the mold layer, wherein the inorganic layer covers at least a portion of the lateral surface of an uppermost memory die of the plurality of memory dies, wherein a top surface of the inorganic layer is substantially coplanar with a top surface of the uppermost memory die of the plurality of memory dies, and wherein the inorganic layer includes oxide or nitride.

公开(公告)号：US20190245386A1

公开(公告)日：2019-08-08

申请号：US16266619

申请日：2019-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon JUNG ,  Kangho BYUN ,  Paul JANG ,  Kiyoung KIM ,  Jaehyun PARK

IPC: H02J50/12 ,  H02M7/5387 ,  H02J50/90 ,  G01R19/00

CPC classification number: H02J50/12 ,  G01R19/0092 ,  H02J50/90 ,  H02M7/53871

Abstract: A wireless power transmission apparatus for wirelessly transmitting power to a wireless power reception apparatus is provided. The wireless power transmission apparatus includes a power transmitting circuit including a coil and at least one processor to control to transmit, via the power transmitting circuit, a pilot power with changing a frequency of the pilot power within a predetermined frequency range, obtain a magnitude of power wirelessly transmitted to a wireless power reception apparatus based on the transmitted pilot power, determine an operating frequency based on the obtained magnitude, and control to transmit, via the power transmitting circuit, a driving power having the operating frequency to drive the wireless power reception apparatus.