公开(公告)号：US11735427B2

公开(公告)日：2023-08-22

申请号：US17544990

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Woo-Mok Son ,  Nam-Hoon Lee ,  Dong-Eog Kim ,  Seung-Hun Oh ,  Eun-Seok Lee ,  Young-Seok Jang

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66 ,  B24B37/10 ,  B24B49/02 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10

CPC classification number: H01L21/304 ,  H01L21/02013 ,  H01L22/12 ,  B24B37/013 ,  B24B37/042 ,  B24B37/10 ,  B24B49/02 ,  B24B49/10

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US20180366358A1

公开(公告)日：2018-12-20

申请号：US15789082

申请日：2017-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Seung Jae Lee ,  Sang Geun Park ,  Dong Seok Baek

IPC: H01L21/68 ,  C23C16/52 ,  G01B11/14 ,  G01B11/27

Abstract: An apparatus for determining alignment of semiconductor processing equipment includes a sensing unit comprising a light emitting unit configured to irradiate a reflection substrate positioned opposite the apparatus and a light accepting unit configured to receive reflected light from the reflection substrate, a control unit configured to determine a gap between the sensing unit and the reflection substrate based on the received reflected light, and a wireless communication unit configured to transmit data regarding the determined gap to an electronic device. Methods of aligning semiconductor processing equipment and methods of fabricating semiconductor devices are also disclosed.

公开(公告)号：US11222786B2

公开(公告)日：2022-01-11

申请号：US16426117

申请日：2019-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Woo-Mok Son ,  Nam-Hoon Lee ,  Dong-Eog Kim ,  Seung-Hun Oh ,  Eun-Seok Lee ,  Young-Seok Jang

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66 ,  B24B37/10 ,  B24B49/02 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US10217653B2

公开(公告)日：2019-02-26

申请号：US15094072

申请日：2016-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongseok Baek ,  Jin Shin ,  Sungman Kim

IPC: H01L21/67 ,  G01N21/95 ,  G01N21/94 ,  B24B49/12 ,  H01L21/68

Abstract: A substrate-treating apparatus according to an example embodiment of the inventive concepts includes a support unit on which a substrate is loaded, an optical measurement unit providing light to the substrate to obtain image data and checking whether the substrate is abnormal or not, based on the image data, and a control unit controlling the support unit and the optical measurement unit. The control unit processes the image data transmitted from the optical measurement unit. The control unit includes an interlock control part performing an interlock operation interrupting a process performed on the substrate if an abnormal signal is detected from the image data.