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公开(公告)号：US20160343597A1
公开(公告)日：2016-11-24
申请号：US15094072
申请日：2016-04-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongseok Baek , Jin SHIN , Sungman KIM
CPC classification number: H01L21/67288 , B24B49/12 , G01N21/94 , G01N21/9501 , G01N2201/0636 , H01L21/67092 , H01L21/67253 , H01L21/681
Abstract: A substrate-treating apparatus according to an example embodiment of the inventive concepts includes a support unit on which a substrate is loaded, an optical measurement unit providing light to the substrate to obtain image data and checking whether the substrate is abnormal or not, based on the image data, and a control unit controlling the support unit and the optical measurement unit. The control unit processes the image data transmitted from the optical measurement unit. The control unit includes an interlock control part performing an interlock operation interrupting a process performed on the substrate if an abnormal signal is detected from the image data.
Abstract translation: 根据本发明的示例性实施例的基板处理装置包括：载体，其上装载有基板的支撑单元，基于基板的光学测量单元向基板提供光以获得图像数据并检查基板是否异常，基于 所述图像数据以及控制所述支持单元和所述光学测量单元的控制单元。 控制单元处理从光学测量单元发送的图像数据。 如果从图像数据检测到异常信号，则控制单元包括互锁控制部分，执行互锁操作中断在基板上执行的处理。
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Patent Agency Ranking
2.发明授权公开(公告)号：US11062924B2
公开(公告)日：2021-07-13
申请号：US16149771
申请日：2018-10-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghyun Cho , Sang-Geun Park , Dongseok Baek , Jaehyuk Choi
Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
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公开(公告)号：US10217653B2
公开(公告)日：2019-02-26
申请号：US15094072
申请日：2016-04-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongseok Baek , Jin Shin , Sungman Kim
Abstract: A substrate-treating apparatus according to an example embodiment of the inventive concepts includes a support unit on which a substrate is loaded, an optical measurement unit providing light to the substrate to obtain image data and checking whether the substrate is abnormal or not, based on the image data, and a control unit controlling the support unit and the optical measurement unit. The control unit processes the image data transmitted from the optical measurement unit. The control unit includes an interlock control part performing an interlock operation interrupting a process performed on the substrate if an abnormal signal is detected from the image data.
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公开(公告)号：US20170098563A1
公开(公告)日：2017-04-06
申请号：US15250186
申请日：2016-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gi-Nam Park , Bokyung Jung , Leekwon Gil , Jungwoo Seo , Dongseok Baek , Nam Hoon Lee , Jonghyun Lee
CPC classification number: H01L21/67115 , H01L21/68735 , H01L21/6875 , H01L21/68785 , H05B3/0047
Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.
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5.发明授权公开(公告)号：US11923214B2
公开(公告)日：2024-03-05
申请号：US17337709
申请日：2021-06-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghyun Cho , Sang-Geun Park , Dongseok Baek , Jaehyuk Choi
CPC classification number: H01L21/67132 , H01L21/67092 , H01L21/67103 , H01L21/67109 , H01L21/67259 , H01L21/67288 , H01L21/6835 , H01L22/12 , H01L23/3121 , H01L23/481 , H01L21/56 , H01L24/13 , H01L24/94 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2224/13023 , H01L2224/13025
Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
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公开(公告)号：US10665483B2
公开(公告)日：2020-05-26
申请号：US15250186
申请日：2016-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gi-Nam Park , Bokyung Jung , Leekwon Gil , Jungwoo Seo , Dongseok Baek , Nam Hoon Lee , Jonghyun Lee
IPC: H01L21/67 , H01L21/687 , H05B3/00
Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.
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