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公开(公告)号：US12046526B2
公开(公告)日：2024-07-23
申请号：US17735471
申请日：2022-05-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Ho Park , Jin-Woo Park , Jae Gwon Jang , Gwang Jae Jeon
CPC classification number: H01L23/3128 , H01L21/565 , H01L24/19 , H01L23/293
Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.
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公开(公告)号：US11233894B2
公开(公告)日：2022-01-25
申请号：US16876978
申请日：2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC: H04M1/72412 , H04W4/80 , H04M1/60 , H04M1/725
Abstract: An electronic device is provided that includes a wireless communication device configured to connect with wireless external devices. The electronic device obtains information regarding the wireless external devices. Before and after a call connection event, it is determined whether each of the wireless external devices includes a microphone based on the information. In response to receiving the call connection event, when it is determined that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone. In response to receiving the call connection event, when it is determined that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two of the plurality of wireless external devices.
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公开(公告)号：US11715645B2
公开(公告)日：2023-08-01
申请号：US17656695
申请日：2022-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-Ho Park , Jin-Woo Park , Seok Hyun Lee , Jae Gwon Jang , Gwang Jae Jeon
IPC: H01L21/48 , H01L21/52 , H01L25/00 , H01L21/56 , H01L23/498
CPC classification number: H01L21/4853 , H01L21/52 , H01L21/565 , H01L23/49816 , H01L25/50
Abstract: A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.
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公开(公告)号：US09373656B2
公开(公告)日：2016-06-21
申请号：US14579311
申请日：2014-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Ho Park
IPC: H01L23/58 , H01L27/146
CPC classification number: H01L27/1463 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14654 , H01L27/14689 , H01L2224/11
Abstract: Image sensor and method of manufacturing the same are provided. The image sensor includes a semiconductor substrate including a pixel area, a voltage connection area, and a pad area, a plurality of photoelectric conversion devices in the pixel area, an anti-reflective layer on a back side of the semiconductor substrate and on the plurality of photoelectric conversion devices, a device isolation structure between the plurality of photoelectric conversion devices, at least one voltage connection structure in the voltage connection area, and electrically connected to the device isolation structure, at least one voltage applying device electrically connected to the at least one voltage connection structure, an internal circuit including at least one conductive inner wire and at least one conductive inner via in an insulating layer, and a through via structure in the pad area.
Abstract translation: 提供了图像传感器及其制造方法。 图像传感器包括：半导体衬底，包括像素区域，电压连接区域和焊盘区域，像素区域中的多个光电转换器件，半导体衬底的背侧上的抗反射层以及多个 的光电转换装置，多个光电转换装置之间的器件隔离结构，电压连接区域中的至少一个电压连接结构，并且电连接到器件隔离结构，至少一个电压施加装置电连接到至少 一个电压连接结构，包括绝缘层中的至少一个导电内部导线和至少一个导电内部通孔的内部电路，以及所述焊盘区域中的通孔结构。
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公开(公告)号：US12009277B2
公开(公告)日：2024-06-11
申请号：US17866866
申请日：2022-07-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Kyu Kim , Jung-Ho Park , Jong Youn Kim , Yeon Ho Jang , Jae Gwon Jang
IPC: H01L23/367 , H01L21/48 , H01L21/683 , H01L21/78 , H01L23/00 , H01L25/00 , H01L25/065 , H01L25/18
CPC classification number: H01L23/3675 , H01L21/4871 , H01L21/6835 , H01L21/78 , H01L24/16 , H01L25/0655 , H01L25/18 , H01L25/50 , H01L2221/68331 , H01L2224/16225 , H01L2924/1431 , H01L2924/1434
Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.
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Patent Agency Ranking
公开(公告)号：US09887461B2
公开(公告)日：2018-02-06
申请号：US14582714
申请日：2014-12-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-U Kim , Austin Kim , Dong-Hwan Kim , Jae-Ho Lee , Jung-Ho Park
CPC classification number: H01Q5/364 , H01Q1/243 , H01Q9/0421 , H01Q9/0442
Abstract: A re-reconfigurable built-in antenna of a portable terminal is provided. The antenna includes an antenna radiator having a feeding pad electrically connected to a feeding portion of a main board of the terminal and at least one ground pad disposed in a position different from that of the feeding pad for selectively establishing an electrical connection to a ground portion of the terminal, and a switching element, commonly connected to the at least one ground pad of the antenna radiator, for selectively establishing an electrical connection to the ground portion by a switching operation. The antenna radiator changes a shape of the antenna radiator by using the selective electrical connection of the ground portion so as to have various operational frequency bands and radiation properties.
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7.发明授权Apparatus and method for controlling built-in microphone of portable terminal 有权用于控制便携式终端内置麦克风的装置和方法公开(公告)号：US09456073B2
公开(公告)日：2016-09-27
申请号：US14842515
申请日：2015-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
CPC classification number: H04M1/7253 , H04M1/6016 , H04M1/6058 , H04M1/6066 , H04M1/725 , H04W4/80
Abstract: An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, provide an incoming call audio signal received via the call establishment to one of the first and second wireless external devices.
Abstract translation: 提供了一种电子设备和方法。 电子设备包括内置麦克风; 蓝牙通信模块，被配置为无线地连接到包括扬声器的第一无线外部设备和包括扬声器的第二无线外部设备; 以及控制器，被配置为检测呼叫建立，如果在所述第一和第二无线外部设备中的一个连接到所述电子设备的同时检测到所述呼叫建立，则基于关于所连接的所述第二和第二无线外部设备的信息来操作所述内置麦克风以接收声音 第一和第二无线外部设备，并且如果在第一和第二无线外部设备都连接到电子设备的同时检测到呼叫建立，则将经由呼叫建立接收的呼入音频信号提供给第一和第二无线外部设备之一 无线外部设备。
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8.发明授权Apparatus and method for controlling built-in microphone of portable terminal 有权用于控制便携式终端内置麦克风的装置和方法公开(公告)号：US09124710B2
公开(公告)日：2015-09-01
申请号：US14325848
申请日：2014-07-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
CPC classification number: H04M1/7253 , H04M1/6016 , H04M1/6058 , H04M1/6066 , H04M1/725 , H04W4/80
Abstract: An apparatus and method for controlling a built-in microphone of a portable terminal is provided. The method includes checking whether a connection device connected to the portable electronic device includes an external microphone; operating the built-in microphone of the portable electronic device to receive a first signal, upon connecting a call, when the connection device does not include the external microphone; and selecting, upon connecting the call while a plurality of connection devices are connected to the portable electronic device, one connection device from among the plurality of connection devices to output a second signal.
Abstract translation: 提供了一种用于控制便携式终端的内置麦克风的装置和方法。 该方法包括检查连接到便携式电子设备的连接装置是否包括外部麦克风; 当所述连接装置不包括所述外部麦克风时，操作所述便携式电子设备的内置麦克风以在连接呼叫时接收第一信号; 以及在多个连接装置连接到所述便携式电子装置的同时，在连接所述呼叫时选择来自所述多个连接装置中的一个连接装置，以输出第二信号。
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公开(公告)号：US11515260B2
公开(公告)日：2022-11-29
申请号：US16874284
申请日：2020-05-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Da Hye Kim , Dong Kyu Kim , Jung-Ho Park
IPC: H01L23/538 , H01L23/00 , H01L25/16 , H01L25/00 , H01L21/683 , H01L21/48 , H01L21/56 , H01L23/31
Abstract: A method for fabricating a semiconductor package includes forming a release layer on a first carrier substrate. An etch stop layer is formed on the release layer. A first redistribution layer is formed on the etch stop layer and includes a plurality of first wires and a first insulation layer surrounding the plurality of first wires. A first semiconductor chip is formed on the first redistribution layer. A solder ball is formed between the first redistribution layer and the first semiconductor chip. A second carrier substrate is formed on the first semiconductor chip. The first carrier substrate, the release layer, and the etch stop layer are removed. The second carrier substrate is removed.
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公开(公告)号：US11328970B2
公开(公告)日：2022-05-10
申请号：US16866594
申请日：2020-05-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Ho Park , Jin-Woo Park , Jae Gwon Jang , Gwang Jae Jeon
Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer. The methods may also include forming a first insulating layer in the opening and protruding beyond a top surface of the portion of the second barrier layer on the sacrificial layer, a top surface of the first insulating layer being farther from the first barrier layer than the top surface of the portion of the second barrier layer, forming a redistribution structure including a redistribution layer and a second insulating layer on the first insulating layer and on the second barrier layer, mounting a semiconductor chip on the redistribution structure, attaching a second carrier onto the semiconductor chip and removing the first carrier, removing the first barrier layer, the sacrificial layer, and the second barrier layer to expose portions of the redistribution structure, and forming solder balls, respectively, on the portions of the redistribution structure.
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