Semiconductor device
    1.
    发明授权

    公开(公告)号:US12272606B2

    公开(公告)日:2025-04-08

    申请号:US18300983

    申请日:2023-04-14

    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate including an active pattern, a gate electrode extending in a first direction and crossing the active pattern which extends in a second direction, a separation structure crossing the active pattern and extending in the first direction, a first gate dielectric pattern disposed on a side surface of the gate electrode, a second gate dielectric pattern disposed on a side surface of the separation structure, and a gate capping pattern covering a top surface of the gate electrode. A level of a top surface of the separation structure is higher than a level of a top surface of the gate capping pattern.

    Semiconductor device having work-function metal and method of forming the same

    公开(公告)号:US12243785B2

    公开(公告)日:2025-03-04

    申请号:US18425390

    申请日:2024-01-29

    Inventor: Juyoun Kim

    Abstract: In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode has a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer. The second gate electrode has a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer. The third gate electrode has a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer. The third gate electrode does not have the first and second conductive layers.

    Semiconductor devices
    3.
    发明授权

    公开(公告)号:US12046650B2

    公开(公告)日:2024-07-23

    申请号:US17120784

    申请日:2020-12-14

    Abstract: A semiconductor device includes a substrate having a first, a second, a third, and a fourth region; a first gate structure in the first region and including a first gate dielectric layer, and a first, a second, and a third conductive layer; a second gate structure in the second region and including a second gate dielectric layer, and the second and the third conductive layer; a third gate structure in the third region and including a third gate dielectric layer, and the second and the third conductive layer; and a fourth gate structure in the fourth region and including the second gate dielectric layer, and a fourth and the third conductive layer. The first gate dielectric layer includes a material of the second gate dielectric layer and a first element, and the third gate dielectric layer includes a material of the second gate dielectric layer and a second element.

    Semiconductor device having work-function metal and method of forming the same

    公开(公告)号:US10734288B2

    公开(公告)日:2020-08-04

    申请号:US16459889

    申请日:2019-07-02

    Inventor: Juyoun Kim

    Abstract: In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode has a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer. The second gate electrode has a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer. The third gate electrode has a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer. The third gate electrode does not have the first and second conductive layers.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240282835A1

    公开(公告)日:2024-08-22

    申请号:US18649646

    申请日:2024-04-29

    CPC classification number: H01L29/42372 H01L27/0924

    Abstract: A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.

    Semiconductor devices including capping layer

    公开(公告)号:US11362187B2

    公开(公告)日:2022-06-14

    申请号:US16950104

    申请日:2020-11-17

    Abstract: A semiconductor device includes first and second active regions on a substrate, an element isolation layer between the first and second active regions, a dummy gate line, dummy gate spacers at opposite side walls of the dummy gate line, and a dummy gate capping layer on the dummy gate line and. An upper surface of the element isolation layer is proximate to an upper surface of the substrate in relation to an upper end of the first active region in a vertical direction. The dummy gate line includes a horizontal section extending on the first active region to the element isolation layer in a horizontal direction, and a vertical section extending downwards from the horizontal section along a side wall of the first active region, the dummy gate line having an L shape, a vertical thickness of the horizontal section being smaller than a vertical thickness of the vertical section.

    SEMICONDUCTOR DEVICE HAVING WORK-FUNCTION METAL AND METHOD OF FORMING THE SAME

    公开(公告)号:US20190326181A1

    公开(公告)日:2019-10-24

    申请号:US16459889

    申请日:2019-07-02

    Inventor: Juyoun Kim

    Abstract: In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode has a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer. The second gate electrode has a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer. The third gate electrode has a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer. The third gate electrode does not have the first and second conductive layers.

    SEMICONDUCTOR DEVICE
    9.
    发明公开

    公开(公告)号:US20240304568A1

    公开(公告)日:2024-09-12

    申请号:US18595666

    申请日:2024-03-05

    CPC classification number: H01L23/562 H01L21/823878 H01L27/092

    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of gate structures which are spaced apart from each other in a first horizontal direction on the semiconductor substrate and extend in a second horizontal direction perpendicular to the first horizontal direction, and a single diffusion brake which extends in the second horizontal direction between the plurality of gate structures and is located in a first trench having a first depth in a vertical direction. The single diffusion brake includes a lower insulating material film conformally disposed on a side wall of the first trench, an insulating liner extending onto upper surfaces of the plurality of gate structures along an inner wall of the lower insulating material film, and an upper insulating material film disposed on the insulating liner and filling the inside of the first trench.

    Semiconductor device and method of fabricating the same

    公开(公告)号:US11978779B2

    公开(公告)日:2024-05-07

    申请号:US17580847

    申请日:2022-01-21

    CPC classification number: H01L29/42372 H01L27/0924

    Abstract: A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.

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