Semiconductor device and method of fabricating the same

    公开(公告)号:US11978779B2

    公开(公告)日:2024-05-07

    申请号:US17580847

    申请日:2022-01-21

    CPC classification number: H01L29/42372 H01L27/0924

    Abstract: A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240282835A1

    公开(公告)日:2024-08-22

    申请号:US18649646

    申请日:2024-04-29

    CPC classification number: H01L29/42372 H01L27/0924

    Abstract: A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20240282834A1

    公开(公告)日:2024-08-22

    申请号:US18649553

    申请日:2024-04-29

    CPC classification number: H01L29/42372 H01L27/0924

    Abstract: A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.

    Semiconductor devices including work function layers

    公开(公告)号:US11380686B2

    公开(公告)日:2022-07-05

    申请号:US17101472

    申请日:2020-11-23

    Abstract: A semiconductor device includes first and second transistors on a substrate. The first transistor includes a first N-type active region, a first gate electrode having a first work function layer, and a first gate dielectric layer having high-k dielectrics containing La. The first work function layer includes a first layer having TiON, a second layer having TiN or TiON, a third layer having TiON, a fourth layer having TiN, and a fifth layer having TiAlC. The second transistor includes a first P-type active region, a second gate electrode having a second work function layer, and a second gate dielectric layer having high-k dielectrics. The second work function layer includes the fifth layer directly contacting the second gate dielectric layer.

    Semiconductor device
    7.
    发明授权

    公开(公告)号:US11164869B2

    公开(公告)日:2021-11-02

    申请号:US16848902

    申请日:2020-04-15

    Abstract: A semiconductor device includes a substrate having an active region, and first to third transistors on the active region of the substrate, each of the first to third transistors including a dielectric layer on the substrate, a metal layer on the dielectric layer, a barrier layer between the dielectric layer and the metal layer, and a work function layer between the dielectric layer and the barrier layer, wherein the barrier layer of the third transistor is in contact with the dielectric layer of the third transistor, and wherein a threshold voltage of the second transistor is greater than a threshold voltage of the first transistor and less than a threshold voltage of the third transistor.

Patent Agency Ranking