公开(公告)号：US10477737B2

公开(公告)日：2019-11-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US11445645B2

公开(公告)日：2022-09-13

申请号：US16262080

申请日：2019-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10531599B2

公开(公告)日：2020-01-07

申请号：US16124836

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-ju Mun ,  Keon Kuk ,  Kyong-il Kim ,  Jin-woo Jung

IPC: H05K9/00 ,  H05K1/18 ,  H05K7/20

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

公开(公告)号：US10426067B2

公开(公告)日：2019-09-24

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10292318B2

公开(公告)日：2019-05-14

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10231368B2

公开(公告)日：2019-03-12

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US10356965B2

公开(公告)日：2019-07-16

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon Kuk ,  Il-ju Mun ,  Ji-woon Yeom ,  Yeon-kyoung Jung ,  Kyong-il Kim

IPC: H05K3/36 ,  H05K9/00 ,  H05K3/30 ,  H05K1/02

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.