公开(公告)号：US11067658B2

公开(公告)日：2021-07-20

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R31/26 ,  G01R35/00 ,  G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

公开(公告)号：US10531599B2

公开(公告)日：2020-01-07

申请号：US16124836

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-ju Mun ,  Keon Kuk ,  Kyong-il Kim ,  Jin-woo Jung

IPC: H05K9/00 ,  H05K1/18 ,  H05K7/20

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

公开(公告)号：US20200088827A1

公开(公告)日：2020-03-19

申请号：US16354633

申请日：2019-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joon-su Ji ,  Dany Kim ,  Han-jik Nam ,  Jin-woo Jung

IPC: G01R35/00 ,  G01R31/28 ,  G01R1/04 ,  G01R1/073

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

公开(公告)号：US10201072B2

公开(公告)日：2019-02-05

申请号：US15489190

申请日：2017-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon Kuk ,  Il-ju Mun ,  Jin-woo Jung ,  Ji-woon Yeom

IPC: H05K1/18 ,  H05K1/02 ,  B05B1/00 ,  H05K3/28 ,  H05K9/00

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.