公开(公告)号：US20250006542A1

公开(公告)日：2025-01-02

申请号：US18442908

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Kyungwook HWANG ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68

Abstract: A semiconductor chip wet transfer method includes: preparing a transfer substrate that includes a plurality of recesses; supplying a liquid that includes semiconductor chips onto the plurality of recesses of the transfer substrate; aligning the semiconductor chips in the plurality of recesses by sweeping, with an align bar, an upper surface of the transfer substrate supplied with the liquid; and performing cleaning by removing semiconductor chips that are not aligned in the plurality of recesses by using a first magnetic force generating device disposed facing a lower surface of the transfer substrate.

公开(公告)号：US20250022980A1

公开(公告)日：2025-01-16

申请号：US18770345

申请日：2024-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghoon SONG ,  Kyungwook HWANG ,  Junsik HWANG ,  Dongho KIM ,  Joonyong PARK ,  Youngtek OH ,  Minchul YU

IPC: H01L33/00

Abstract: A chemical lift-off device includes a first chamber including a first bath containing a first chemical solution and configured to receive a semiconductor light-emitting device on a substrate, such that the semiconductor light-emitting device is partially separated from the substrate by being submerged in the first chemical solution, a cleaning bath containing deionized water and configured to receive the semiconductor light-emitting device that is partially separated from the substrate, and a second chamber including a separator including a chemical solution sprayer configured to spray a second chemical solution toward the semiconductor light-emitting device that is partially separated from the substrate, such that the semiconductor light-emitting device is completely separated from the substrate by being sprayed with the second chemical solution and a recovery assembly provided at a lower portion of the separator and configured to recover the semiconductor light-emitting device that is completely separated from the substrate.

公开(公告)号：US20240234219A1

公开(公告)日：2024-07-11

申请号：US18409369

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Joonyong PARK ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L21/66 ,  H01L21/683 ,  H01L25/16

CPC classification number: H01L22/22 ,  H01L21/6835 ,  H01L25/167 ,  H01L2221/68368

Abstract: A method of transferring a micro semiconductor chip and a transferring structure are provided. The method includes providing a plurality of base transferring substrates each including a plurality of grooves, aligning the plurality of base transferring substrates on a first substrate, aligning the plurality of base transferring substrates on a second substrate, providing a target transferring structure by transferring micro semiconductor chips to the base transferring substrates of the first substrate, and providing a preliminary transferring structure by transferring micro semiconductor chips to the base transferring substrates of the second substrate.

公开(公告)号：US20250054813A1

公开(公告)日：2025-02-13

申请号：US18795805

申请日：2024-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook HWANG ,  Jaewook JEONG ,  Jonghyun JEONG ,  Minchul YU ,  Sanghoon SONG ,  Dongho KIM ,  Joonyong PARK ,  Youngtek OH ,  Junsik HWANG

IPC: H01L21/78 ,  H01L21/306 ,  H01L21/67 ,  H01L33/00 ,  H01L33/22

Abstract: Provided are a semiconductor chip, a method of preparing a semiconductor chip, and an apparatus for manufacturing a semiconductor chip. The method includes separating a semiconductor chip from a laminate, the laminate including a substrate, a lift-off layer on the substrate, and a semiconductor layer on the lift-off layer. The method further includes removing the lift-off layer with an etchant by applying a magnetic field while contacting the laminate and the etchant, to thereby prepare a semiconductor chip.

公开(公告)号：US20240178342A1

公开(公告)日：2024-05-30

申请号：US18198089

申请日：2023-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L33/00

CPC classification number: H01L33/005

Abstract: A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.

公开(公告)号：US20210248340A1

公开(公告)日：2021-08-12

申请号：US17009384

申请日：2020-09-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  ZINITIX CO., LTD.

Inventor： Minchul YU ,  Byeongchecl SO ,  Hieminn KANG ,  Taihyun YOON

IPC: G06K9/00 ,  G06F3/044

Abstract: Disclosed are a fingerprint detection device and a method therefor. A fingerprint detection device includes: a touch panel; at least one amplifier including a first integrator amplifying an electrical signal received from the touch panel to a signal of a first polarity and a second integrator amplifying the electrical signal to a signal of a second polarity; and a processor configured to control the amplifier to perform a first integration process and a second integration process with respect to a plurality of electrical signals received from a plurality of nodes of the touch panel.

公开(公告)号：US20240322068A1

公开(公告)日：2024-09-26

申请号：US18433068

申请日：2024-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Dongho KIM ,  Joonyong PARK ,  Junsik HWANG ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L33/005 ,  H01L21/67132 ,  H01L21/67333

Abstract: A micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.

公开(公告)号：US20240079385A1

公开(公告)日：2024-03-07

申请号：US18120166

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38

Abstract: Provided are a micro semiconductor chip transferring structure and a display device employing a display transferring structure. A transferring structure includes a transfer substrate having a plurality of grooves, and a plurality of micro semiconductor chips transferred to the plurality of grooves, respectively, wherein a minimum space between adjacent two of the plurality of micro semiconductor chips transferred to the plurality of grooves is 100% to 200% inclusive of a width of each of the plurality of micro semiconductor chips.

公开(公告)号：US20240006199A1

公开(公告)日：2024-01-04

申请号：US18086992

申请日：2022-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Minchul YU ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67333

Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.

公开(公告)号：US20240234384A1

公开(公告)日：2024-07-11

申请号：US18402416

申请日：2024-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Youngtek OH ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L25/075

CPC classification number: H01L25/0753

Abstract: A method of transferring electronic chips includes attaching, to a relay substrate, the electronic chips arranged on a base substrate, separating the electronic chips from the base substrate, wetting a target substrate using a solvent, transferring, to the target substrate, the electronic chips that are attached to the relay substrate, pressing the relay substrate in a thickness direction of the target substrate, and drying the target substrate.