公开(公告)号：US20150346868A1

公开(公告)日：2015-12-03

申请号：US14725604

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON

IPC: G06F3/044 ,  C23C14/34 ,  C23C14/58 ,  G06F3/041

CPC classification number: G06F3/044 ,  C03C17/2453 ,  C03C2217/231 ,  C03C2218/328 ,  G06F3/0412 ,  G06F2203/04101 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L31/1884

Abstract: An electronic device having an electrode pattern for a touch sensor is provided. The electronic device include a touch sensor; and a touch key that is formed at a position corresponding to the electrode pattern for the touch sensor and corresponds to a touch region. The electrode pattern is an Indium Tin Oxide (ITO) pattern.

Abstract translation: 提供了一种具有用于触摸传感器的电极图案的电子设备。 电子设备包括触摸传感器; 以及触摸键，其形成在与用于触摸传感器的电极图案相对应的位置处，并且对应于触摸区域。 电极图案是氧化铟锡（ITO）图案。

公开(公告)号：US20230350472A1

公开(公告)日：2023-11-02

申请号：US18346394

申请日：2023-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Seunghoon KANG ,  Boram KIM ,  Hongki MOON ,  Yoonsun PARK ,  Kyungwoo LEE ,  Seungjoo LEE ,  Jonghoon LIM

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC classification number: G06F1/203 ,  H01L23/427 ,  G06F1/206 ,  G06F1/1637

Abstract: Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.

公开(公告)号：US20210059076A1

公开(公告)日：2021-02-25

申请号：US16988980

申请日：2020-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Min PARK ,  Jaeyoung HUH ,  Daesuk KANG ,  Ji EOM ,  Ewidon JEONG ,  Sungchul PARK

IPC: H05K7/20 ,  G06F1/20 ,  H01Q1/02

Abstract: A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.

公开(公告)号：US20230422448A1

公开(公告)日：2023-12-28

申请号：US18039656

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Jonghoon LIM ,  Ohhyuck KWON ,  Ahreum HWANG ,  Sungchul PARK

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/20481 ,  G06F1/203 ,  G06F1/1681 ,  G06F1/1652 ,  G06F2200/203

Abstract: A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the first and second housings, a hinge housing accommodating the hinge assembly and disposed between the first and second housings, a flexible display disposed from one region of the first housing to a region of the second housing across the hinge assembly, and foldable depending on a rotation of the hinge assembly, a first plate disposed between the flexible display and the first housing, a second plate disposed between the flexible display and the second housing, and a first heat dissipating structure disposed between the first component and thermally coupled to one end of the hinge housing, and providing a first heat transfer path for transferring heat generated from the first component to the hinge housing.

公开(公告)号：US20200220572A1

公开(公告)日：2020-07-09

申请号：US16733975

申请日：2020-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Boram KIM ,  Jonghoon LIM ,  Sungchul PARK

IPC: H04B1/44 ,  H04B1/00 ,  H01Q3/24 ,  H01Q21/00 ,  H04M1/02

Abstract: Methods and devices for antenna switching are provided. A wireless signal is transmitted and received through a specific antenna module among a plurality of antenna modules. Status information about each of one or more other antenna modules among the plurality of antenna modules is acquired, when a temperature of the specific antenna module exceeds a predetermined value. The temperature of the specific antenna module is measured through a respective sensor module of a plurality of sensor modules. Each sensor module of the plurality of sensor modules is contained in or disposed adjacent to a respective antenna module of the plurality of antenna modules. The specific antenna module is switched to an antenna module selected from among the one or more other antenna modules, based on the acquired status information.

公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

公开(公告)号：US20230378993A1

公开(公告)日：2023-11-23

申请号：US18363908

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Boram KIM ,  Jonghoon LIM ,  Sungchul PARK

IPC: H04B1/44 ,  H01Q3/24 ,  H01Q21/00 ,  H04B1/00 ,  H04M1/02

CPC classification number: H04B1/44 ,  H01Q3/24 ,  H01Q21/0025 ,  H04B1/0064 ,  H04M1/026 ,  H04M2250/12

Abstract: An electronic device and method thereof are provided. A method includes, while a wireless communication of a first frequency band is performed via a first 5G antenna, obtaining first status information related to the first 5G antenna and second status information related to a second 5G antenna; if the first status information does not satisfy a first predetermined condition and the second status information satisfies a second predetermined condition, switching from the first 5G antenna to the second 5G antenna, and performing the wireless communication in the first frequency band via the second 5G antenna; and if the first status information does not satisfy the first predetermined condition and the second status information does not satisfy the second predetermined condition, switching from the first 5G antenna to a legacy communication antenna, and performing the wireless communication in a second frequency band via the legacy communication antenna.

公开(公告)号：US20180247143A1

公开(公告)日：2018-08-30

申请号：US15904111

申请日：2018-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung CHO ,  Ohhyuck KWON ,  Hyungdal KIM ,  Heungsik SHIN ,  Jiwoong OH

IPC: G06K9/00 ,  G06K9/60

CPC classification number: G06K9/00912 ,  G06F21/36 ,  G06K9/00013 ,  G06K9/0004 ,  G06K9/60 ,  H04L63/0861

Abstract: According to various embodiments of the present disclosure, an electronic device includes a display, a biometric sensor disposed in the display, and a processor electrically connected to the display and the biometric sensor. The processor is configured to activate a pixel included in the display, acquire position information corresponding to the pixel through the biometric sensor, and identify a position of the biometric sensor disposed in the display based on the position information. Other embodiments are disclosed.