公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungbok LEE ,  Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Jieun HWANG ,  Myungjun KIM ,  Min PARK ,  Sunga YANG

IPC: H01L23/552 ,  H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H05K7/20445 ,  H05K9/0032

Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.

公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.