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公开(公告)号:US20240047339A1
公开(公告)日:2024-02-08
申请号:US18106540
申请日:2023-02-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: SEUNGMIN CHA , SEUNGMIN SONG , YOUNGWOO KIM , JINKYU KIM , SORA YOU , NAMHYUN LEE , SUNGMOON LEE
IPC: H01L23/50 , H01L29/66 , H01L29/78 , H01L27/088 , H01L27/092 , H01L29/423 , H01L23/535 , H01L23/522 , H01L23/528
CPC classification number: H01L23/50 , H01L29/66795 , H01L29/785 , H01L29/66545 , H01L27/0886 , H01L27/0924 , H01L29/4236 , H01L23/535 , H01L23/5226 , H01L23/5286
Abstract: An integrated circuit device includes a substrate, having a front surface and a rear surface opposite to each other, and a fin-type active region defined by a trench in the front surface, a device separation layer filling the trench, a source/drain region on the fin-type active region, a first conductive plug arranged on the source/drain region and electrically connected to the source/drain region, a power wiring line at least partially arranged on a lower surface of the substrate, a buried rail connected to the power wiring line through the device separation layer and decreasing in horizontal width toward the power wiring line, and a power via connecting the buried rail to the first conductive plug.
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公开(公告)号:US20220310809A1
公开(公告)日:2022-09-29
申请号:US17841873
申请日:2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Doohyun Lee , HYUN-SEUNG SONG , YEONGCHANG ROH , HEONJONG SHIN , SORA YOU , YONGSIK JEONG
IPC: H01L29/417 , H01L29/49 , H01L23/535 , H01L29/08 , H01L29/423 , H01L23/532
Abstract: A semiconductor device comprising a gate electrode on a substrate, a source/drain pattern on the substrate on a side of the gate electrode, and a gate contact plug on the gate electrode are disclosed. The gate contact plug may include a first gate contact segment, and a second gate contact segment that extends in a vertical direction from a top surface of the first gate contact segment. An upper width of the first gate contact segment may be greater than a lower width of the second gate contact segment.
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