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公开(公告)号：US20250123036A1
公开(公告)日：2025-04-17
申请号：US18824826
申请日：2024-09-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taeil KIM , Naeseong LEE , Minwoo LEE , Min CHANG , Sangyoon HAN , Seokhyun JANG
Abstract: A heat pump system may include a compressor, a water-refrigerant heat exchanger, an expansion valve, an outdoor heat exchanger, an outlet temperature sensor configured to detect an outlet temperature of the water-refrigerant heat exchanger, an outside temperature sensor, a discharge pressure sensor, a suction pressure sensor, and at least one processor. The at least one processor may obtain, during a heating operation, a first target discharge temperature of the compressor based on an output value from the outlet temperature sensor and an output value from the outside temperature sensor, obtain a second target discharge temperature of the compressor based on an output value from the discharge pressure sensor and an output value from the suction pressure sensor, set any one of the first target discharge temperature or the second target discharge temperature to a final target discharge temperature, and control the expansion valve based on the final target discharge temperature.
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Patent Agency Ranking
公开(公告)号：US20210063042A1
公开(公告)日：2021-03-04
申请号：US17006142
申请日：2020-08-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongwon BAK , Taeil KIM , Hyunkook KIM , Sangyoon HAN , Changhee HAN , Jejin LEE , Byoungguk LIM
Abstract: An air conditioner and control method for reducing power consumption by controlling pressure or temperature of a refrigerant. The air conditioner includes a compressor compressing a refrigerant and discharging a high pressure refrigerant gas; an outdoor heat exchanger in which the high pressure refrigerant gas is changed to a refrigerant fluid; an outdoor fan to blow outdoor air to the outdoor heat exchanger; a decompressor decompressing the refrigerant fluid into a low pressure state; an indoor heat exchanger changing the decompressed low pressure refrigerant fluid to a refrigerant gas; and a controller configured to control pressure or temperature of the refrigerant based on an operation condition including at least two of a first condition determined based on an installation environment, a second condition determined based on an optimal compression ratio of the compressor, a third condition determined based on outdoor temperature, and a fourth condition set as a default value.
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公开(公告)号：US20220325911A1
公开(公告)日：2022-10-13
申请号：US17728360
申请日：2022-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taeil KIM , Sukho LEE , Jejin LEE , Donghan KO , Sangho YOO , Dongkyu LEE , Jaeyang LEE , Changyong LEE , Dongil JUNG , Sangyoon HAN
Abstract: An air conditioner including: a compressor; a heat exchanger fluidly connected to the compressor; a pressure sensor provided in a first flow path connecting an outlet of the compressor to an inlet of the first heat exchanger; a temperature sensor provided in a second flow path connected to an outlet of the heat exchanger; and a processor connected to the compressor, the pressure sensor, and the temperature sensor. The processor configured to: acquire a reference index value based on a first reference pressure measured by the pressure sensor and a first reference temperature measured by the temperature sensor, acquire a measurement index value based on a first measurement pressure measured by the pressure sensor and a first measurement temperature measured by the temperature sensor, and display a shortage of a refrigerant of the air conditioner based on the reference index value and the measurement index value.
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公开(公告)号：US20250076360A1
公开(公告)日：2025-03-06
申请号：US18823964
申请日：2024-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Daesung JUNG , Seongbeom LEE , Gyouil JEONG , Sangyoon HAN , Myungjoon KIM , Kyuhwang WON , Jaein JEONG , Hoomi CHOI
IPC: G01R29/24 , H01L21/66 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: A substrate inspection apparatus includes a substrate support portion that fixedly holds a semiconductor substrate such that an upper surface and a lower surface of the semiconductor substrate are exposed; an upper inspection portion including an upper probe having a first end portion spaced apart from the upper surface, and an upper charge sensor in the first end portion that obtains an upper surface charge sensing value from the upper surface; and a lower inspection portion including a lower probe having a second end portion spaced apart from the lower surface, and a lower charge sensor in the second end portion that obtains a lower surface charge sensing value from the lower surface.
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公开(公告)号：US20250020377A1
公开(公告)日：2025-01-16
申请号：US18649112
申请日：2024-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangyoon HAN , Taeil KIM , Naeseong LEE , Minwoo LEE , Min CHANG , Seokhyun JANG
Abstract: A heat pump system may include: a compressor configured to compress a refrigerant; a refrigerant-water heat exchanger configured to perform heat exchange between the compressed refrigerant and inlet water; an expansion valve configured to expand the refrigerant condensed in the refrigerant-water heat exchanger; an outdoor heat exchanger configured to perform heat exchange between the refrigerant expanded in the expansion valve and outdoor air; a high pressure sensor configured to detect a high pressure saturation temperature of the refrigerant compressed in the compressor; an inlet water temperature sensor configured to detect a temperature of water flowing into the refrigerant-water heat exchanger; a condensation temperature sensor configured to detect a temperature of the refrigerant condensed in the refrigerant-water heat exchanger; an outdoor temperature sensor configured to detect an outdoor temperature; and a controller including at least one processor, comprising processing circuitry, individually and/or collectively, configured to: determine a reference supercooling degree of the refrigerant based on detection of outdoor temperature by the outdoor temperature sensor and inlet water temperature by the inlet water temperature sensor and an operating frequency of the compressor, determine a current degree of supercooling of the refrigerant based on detection of pressure saturation temperature by the high pressure sensor and condensation temperature by the condensation temperature sensor, and determine whether the refrigerant leaks by comparing the reference supercooling degree and the current degree of supercooling.
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公开(公告)号：US20240401855A1
公开(公告)日：2024-12-05
申请号：US18802836
申请日：2024-08-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taeil KIM , Sukho LEE , Min CHANG , Sangyoon HAN
Abstract: A heat pump system according to an aspect of the disclosure may comprise: a compressor configured to compress a refrigerant; a water heat exchanger configured to exchange heat between the compressed refrigerant and introduced water; an expansion valve configured to expand the refrigerant condensed in the water heat exchanger; an outdoor heat exchanger configured to exchange heat between the refrigerant expanded by the expansion valve and outdoor air; a high-tension pressure sensor configured to detect the temperature of the refrigerant to be condensed in the water heat exchanger; a discharged water temperature sensor configured to detect the temperature of water on which heat exchange has been performed in the water heat exchanger; and a control unit including a controller comprising circuitry configured to: determine a target condensation temperature of the refrigerant based on a detection result of the discharged water temperature sensor, compare the target condensation temperature with the current condensation temperature detected by the high-tension pressure sensor, and control the degree of opening of the expansion valve based on the comparison result.
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