VARIABLE RESISTANCE MEMORY DEVICE INCLUDING SYMMETRICAL MEMORY CELL ARRANGEMENTS AND METHOD OF FORMING THE SAME

    公开(公告)号:US20200027925A1

    公开(公告)日:2020-01-23

    申请号:US16354545

    申请日:2019-03-15

    Abstract: A variable resistance non-volatile memory device can include a semiconductor substrate and a plurality of first conductive lines each extending in a first direction perpendicular to the semiconductor substrate and spaced apart in a second direction on the semiconductor substrate. A second conductive line can extend in the second direction parallel to the semiconductor substrate on a first side of the plurality of first conductive lines and a third conductive line can extend in the second direction parallel to the semiconductor substrate on a second side of the plurality of first conductive lines opposite the first side of the plurality of first conductive lines. A plurality of first non-volatile memory cells can be on the first side of the plurality of first conductive lines and each can be coupled to the second conductive line and to a respective one of the plurality of first conductive lines, where each of the plurality of first non-volatile memory cells can include a switching element, a variable resistance element, and an electrode arranged in a first sequence. A plurality of second non-volatile memory cells can be on the second side of the plurality of first conductive lines and each can be coupled to the third conductive line and to a respective one of the plurality of first conductive lines, wherein each of the plurality of second non-volatile memory cells includes a switching element, a variable resistance element, and an electrode that are arranged in a second sequence, wherein the first sequence and the second sequence are symmetrical with one another about the plurality of first conductive lines.

    SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

    公开(公告)号:US20240324184A1

    公开(公告)日:2024-09-26

    申请号:US18504226

    申请日:2023-11-08

    CPC classification number: H10B12/482 H10B12/02 H10B12/315

    Abstract: A semiconductor device may include a device isolation part on a substrate, the device isolation part defining a first active portion and a second active portion, with a center portion of the first active portion adjacent in a first direction to an edge portion of the second active portion, A first impurity region may be in the center portion of the first active portion, and a second impurity region may be in the edge portion of the second active portion. A first bit line may be in direct contact with the first impurity region and may extend across the substrate in a second direction that intersects the first direction. A storage node contact may be in contact with the second impurity region, with an upper sidewall and a lower sidewall of the storage node contact on a common side of the storage node contact not vertically aligned with each other.

    Variable resistance memory device including symmetrical memory cell arrangements and method of forming the same

    公开(公告)号:US10971548B2

    公开(公告)日:2021-04-06

    申请号:US16354545

    申请日:2019-03-15

    Abstract: A variable resistance non-volatile memory device can include a semiconductor substrate and a plurality of first conductive lines each extending in a first direction perpendicular to the semiconductor substrate and spaced apart in a second direction on the semiconductor substrate. A second conductive line can extend in the second direction parallel to the semiconductor substrate on a first side of the plurality of first conductive lines and a third conductive line can extend in the second direction parallel to the semiconductor substrate on a second side of the plurality of first conductive lines opposite the first side of the plurality of first conductive lines. A plurality of first non-volatile memory cells can be on the first side of the plurality of first conductive lines and each can be coupled to the second conductive line and to a respective one of the plurality of first conductive lines, where each of the plurality of first non-volatile memory cells can include a switching element, a variable resistance element, and an electrode arranged in a first sequence. A plurality of second non-volatile memory cells can be on the second side of the plurality of first conductive lines and each can be coupled to the third conductive line and to a respective one of the plurality of first conductive lines, wherein each of the plurality of second non-volatile memory cells includes a switching element, a variable resistance element, and an electrode that are arranged in a second sequence, wherein the first sequence and the second sequence are symmetrical with one another about the plurality of first conductive lines.

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