MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF

    公开(公告)号:US20210065803A1

    公开(公告)日:2021-03-04

    申请号:US16834025

    申请日:2020-03-30

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

    APPARATUSES AND METHODS FOR ADJUSTING SKEWS BETWEEN DATA AND CLOCK

    公开(公告)号:US20250103091A1

    公开(公告)日:2025-03-27

    申请号:US18756305

    申请日:2024-06-27

    Abstract: Provided are an apparatus and a method for adjusting a skew between data and a clock. The apparatus driven by a supply voltage includes a clock circuit that adjusts a skew between data and a clock. The clock circuit performs a first loop operation through a first loop and a second loop operation through a second loop, based on a phase difference between data and a clock. The first loop operation is performed until there is no phase difference between the data and the clock, and the second loop operation is performed until a first slope representing a change in delay of the data with respect to the levels of the power voltage and a second slope representing a change in delay of the clock become identical to each other.

    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF

    公开(公告)号:US20210366546A1

    公开(公告)日:2021-11-25

    申请号:US17393784

    申请日:2021-08-04

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

    MULTI-CHIP PACKAGE WITH REDUCED CALIBRATION TIME AND ZQ CALIBRATION METHOD THEREOF

    公开(公告)号:US20210065753A1

    公开(公告)日:2021-03-04

    申请号:US17012845

    申请日:2020-09-04

    Abstract: A multi-chip package with reduced calibration time and an impedance control (ZQ) calibration method thereof are provided. A master chip of the multi-chip package performs a first ZQ calibration operation by using a ZQ resistor, and then, the other slave chips simultaneously perform second ZQ calibration operations with respect to data input/output (DQ) pads of the slave chips by using a termination resistance value of a DQ pad of the master chip on the basis of a one-to-one correspondence relationship with the DQ pad of the master chip. The multi-chip package completes ZQ calibration by performing two ZQ calibration operations, thereby decreasing a ZQ calibration time.

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