公开(公告)号：US20200322467A1

公开(公告)日：2020-10-08

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Seunghoon KANG ,  Boram KIM ,  Youngjin KIM ,  Sunghoon MOON ,  Hongki MOON ,  Yoonsun PARK ,  Hajoong YUN ,  Jonghoon LIM

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing

公开(公告)号：US20210391636A1

公开(公告)日：2021-12-16

申请号：US17402055

申请日：2021-08-13

Applicant: Samsung Electronics Co., Ltd. ,  Amotech Co., Ltd.

Inventor： Seunghoon KANG ,  Jinhyoung LEE ,  Kyungha KOO ,  Jinmyoung KIM ,  Hongki MOON ,  Yoonsun PARK ,  Seyoung JANG ,  Seungjae HWANG

IPC: H01Q1/02 ,  H01Q1/24

Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.

公开(公告)号：US20230350472A1

公开(公告)日：2023-11-02

申请号：US18346394

申请日：2023-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck KWON ,  Jaeyoung HUH ,  Daesuk KANG ,  Seunghoon KANG ,  Boram KIM ,  Hongki MOON ,  Yoonsun PARK ,  Kyungwoo LEE ,  Seungjoo LEE ,  Jonghoon LIM

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

CPC classification number: G06F1/203 ,  H01L23/427 ,  G06F1/206 ,  G06F1/1637

Abstract: Disclosed is an electronic device including a housing including a first surface, a second surface facing away the first surface, and a third surface surrounding a space between the first surface and the second surface; a display exposed through the first surface; a battery disposed in the space; a heating source disposed between the battery and the third surface; and a thermal diffusion member disposed between the heating source and the battery. The thermal diffusion member includes a fluid; a first portion disposed adjacent to the heating source for receiving heat from the heating source; and at least one second portion extending from the first portion. The heat transferred from the heating source to the first portion is transferred from the first portion to the at least one second portion.

公开(公告)号：US20230195167A1

公开(公告)日：2023-06-22

申请号：US18083322

申请日：2022-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeran JUNG ,  Seunghoon KANG ,  Hongki MOON ,  Jongkil PARK ,  Seungjoo LEE

IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/1624 ,  G06F1/1652 ,  G06F1/20 ,  H05K7/20963

Abstract: According to various embodiments of the disclosure, an electronic device may comprise a housing including a first housing and a second housing for guiding a sliding movement of the first housing, a display having at least a portion configured to be unfolded based on the sliding movement of the first housing and including a first display area disposed on the first housing and a second display area extending from the first display area, an electrical component disposed in the housing, a heat dissipation sheet configured to receive heat generated from the electrical component and including a bending area facing the first display area and a fixed area facing the second display area, and a slit structure formed in at least a portion of the bending area and including at least a portion extending along a first direction inclined from a direction of the sliding movement of the first housing.

公开(公告)号：US20210119671A1

公开(公告)日：2021-04-22

申请号：US17060743

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonjun JUNG ,  Seunghoon KANG ,  Kiyong SON

IPC: H04B5/00 ,  H03F3/193 ,  H02J50/80 ,  H03F3/24 ,  H02J50/12

Abstract: A switching transformer includes a drive amplifier configured to output an input signal by amplifying a source signal, a primary circuit including a set of primary inductors, a primary switch, and a first primary connecting wire, the set of primary inductors being configured to receive the input signal at a first primary input/output terminal, the primary switch being configured to adjust an inductance of the set of primary inductors based on a first switching operation, and the first primary connecting wire being configured to electrically connect the first primary input/output terminal to an end of the primary switch, and a secondary circuit configured to mutually electrically couple to the first primary connecting wire and at least one primary inductor among the set of primary inductors.

公开(公告)号：US20210410268A1

公开(公告)日：2021-12-30

申请号：US17293280

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Seyoung JANG ,  Woojune JUNG

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

公开(公告)号：US20200267828A1

公开(公告)日：2020-08-20

申请号：US16795223

申请日：2020-02-19

Applicant: Samsung Electronics Co, Ltd

Inventor： Hongki MOON ,  Yoonsun PARK ,  Seunghoon KANG ,  Kyungha KOO ,  Hajoong YUN ,  Seungjoo LEE ,  Yeonjoo LEE ,  Seyoung JANG

IPC: H05K1/02 ,  H02J50/27

Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.