公开(公告)号：US20140151437A1

公开(公告)日：2014-06-05

申请号：US14089366

申请日：2013-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-Soo Choi ,  Min Kim ,  Tae-Ho Moon ,  Ju-Young Yu ,  Sung-Bok Hong

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/757 ,  H01L2224/759 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/014

Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract translation: 芯片安装装置包括加载单元，组合单元和结合单元。 装载单元将具有接触焊盘的电路板和具有焊球的半导体芯片加载到芯片安装装置中。 组合单元将半导体芯片定位在电路板的相应安装区域上，并且通过使用焊剂将半导体芯片的焊球与电路板的接触焊盘组合。 组合单元具有用于涂覆助焊剂的焊剂焊剂和用于将焊剂自动补充到焊剂涂布机的焊剂控制器的焊剂涂布机。 接合单元通过回流工艺将焊球接合到相应的接触焊盘。

公开(公告)号：US08905290B2

公开(公告)日：2014-12-09

申请号：US14089366

申请日：2013-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-Soo Choi ,  Min Kim ,  Tae-Ho Moon ,  Ju-Young Yu ,  Sung-Bok Hong

IPC: B23K37/00 ,  B23K31/02 ,  H01L23/00

CPC classification number: H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/757 ,  H01L2224/759 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/014

Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract translation: 芯片安装装置包括加载单元，组合单元和结合单元。 装载单元将具有接触焊盘的电路板和具有焊球的半导体芯片加载到芯片安装装置中。 组合单元将半导体芯片定位在电路板的相应安装区域上，并且通过使用焊剂将半导体芯片的焊球与电路板的接触焊盘组合。 组合单元具有用于涂覆助焊剂的焊剂焊剂和用于将焊剂自动补充到焊剂涂布机的焊剂控制器的焊剂涂布机。 接合单元通过回流工艺将焊球接合到相应的接触焊盘。