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公开(公告)号：US20200267834A1
公开(公告)日：2020-08-20
申请号：US16796041
申请日：2020-02-20
发明人： Woosup LEE , Younghoon KIM , Jungsik PARK , Inkuk YUN , Sunghyup LEE , Heeseok JUNG , Sehwan CHOI , Taewook HAM
摘要： An electronic device is disclosed. An electronic device according to various embodiments includes: a housing including a first surface and a second surface disposed to face the first surface and defining an internal space; a battery disposed adjacent to the second surface of the housing; and an antenna module comprising at least one coil disposed to face the first surface on the battery, wherein the antenna module includes: a base; a first wireless charging coil disposed on a surface of the base; a first NFC coil spaced apart from the first wireless charging coil disposed on a surface of the base and disposed outside the first wireless charging coil; a second wireless charging coil disposed at a position corresponding to the first wireless charging coil on an other surface of the base; a second NFC coil disposed at a position corresponding to the first NFC coil on the other surface of the base and surrounding a partial region of the second wireless charging coil; and a shield sheet disposed under the second wireless charging coil and the second NFC coil, and the antenna module includes a first region in which the second NFC coil and the second wireless charging coil are disposed and a second region corresponding to an other region, and the shield sheet has different thicknesses in the first region and the second region.
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公开(公告)号：US20240214007A1
公开(公告)日：2024-06-27
申请号：US18601237
申请日：2024-03-11
发明人： Yoondo LEE , Sigwan KIM , Hyelee SONG , Dongryul SHIN , Dongmin SHIN , Yoonjae LEE , Handug LEE , Woosik CHO , Weonjai CHOI , Taewook HAM , Kyunggu KIM , Hongpyo BAE , Jinwoo JUNG , Youngjun CHO
CPC分类号： H04B1/0064 , H01Q1/243 , H01Q5/50 , H01Q21/08 , H05K1/0243 , H05K1/0277 , H05K7/1427 , H05K2201/10098
摘要： In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
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公开(公告)号：US20240206120A1
公开(公告)日：2024-06-20
申请号：US18594595
申请日：2024-03-04
发明人： Taewook HAM , Moonhyung KWON , Younggirl YUN , Taekkyun CHOI , Wonhyung HEO
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： The present disclosure relates to an electronic device comprising a heat dissipation structure. The electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.
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公开(公告)号：US20230155610A1
公开(公告)日：2023-05-18
申请号：US16976907
申请日：2020-07-31
发明人： Yoondo LEE , Sigwan KIM , Hyelee SONG , Dongryul SHIN , Dongmin SHIN , Yoonjae LEE , Handug LEE , Woosik CHO , Weonjai CHOI , Taewook HAM , Kyunggu KIM , Hongpyo BAE , Jinwoo JUNG , Youngjun CHO
CPC分类号： H04B1/0064 , H01Q1/243 , H01Q21/08 , H01Q5/50 , H05K7/1427 , H05K1/0243 , H05K1/0277 , H05K2201/10098
摘要： In embodiments, an electronic device may include a housing having an inner space, a printed circuit board (PCB) disposed in the inner space of the housing, a first antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a first frequency band, at least one second antenna structure disposed at a position spaced apart from the PCB, and transmitting and/or receiving a radio signal in a second frequency band different from the first frequency band, and a flexible substrate electrically connecting the PCB and the first antenna structure. The flexible substrate may include a first connecting portion electrically connected to the PCB, an interconnecting portion extended from the first connecting portion to the first antenna structure, at least one branch portion branched from at least a part of the interconnecting portion, and extended to the at least one second antenna structure, at least one first conductive path disposed in the interconnecting portion, and electrically connecting the first connecting portion and the first antenna structure, and at least one second conductive path disposed in the interconnecting portion and the at least one branch portion, and electrically connecting the first connecting portion and the at least one second antenna structure.
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公开(公告)号：US20230262940A1
公开(公告)日：2023-08-17
申请号：US18303284
申请日：2023-04-19
发明人： Taewook HAM , Moonhyung KWON , Min PARK , Younggirl YUN , Taekkyun CHOI
CPC分类号： H05K7/20481 , G06F1/203
摘要： An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.
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公开(公告)号：US20210249760A1
公开(公告)日：2021-08-12
申请号：US17168321
申请日：2021-02-05
发明人： Younghoon KIM , Juhyun PARK , Younggirl YUN , Taewook HAM , Haejin LEE , Jooho JANG
摘要： According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.
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