公开(公告)号：US20240254623A1

公开(公告)日：2024-08-01

申请号：US18421553

申请日：2024-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changhwan Kim ,  Takafumi Noguchi ,  Toshihiro Iizuka ,  Kenichi Nagayama

IPC: C23C16/448 ,  C23C16/455

CPC classification number: C23C16/448 ,  C23C16/45557 ,  C23C16/45561

Abstract: A vapor supply apparatus is described. The apparatus stably supplies vapor to a process chamber when the vapor pressure of the material is lower than the process pressure. The apparatus includes a supply container accommodating a solid or a liquid having a vapor pressure which is lower than the process pressure. The vapor may be generated in the supply container from a liquid or from a solid. A buffer tank is interposed between the supply container and the process chamber and into which the vapor from the container is introduced by reducing pressure. The apparatus includes a mechanism for pressurizing the buffer tank and pressure-feeding the vapor to the process chamber.

公开(公告)号：US11424140B2

公开(公告)日：2022-08-23

申请号：US17035023

申请日：2020-09-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changhwan Kim ,  Toshihiro Iizuka ,  Kenichi Nagayama ,  Takafumi Noguchi

IPC: B05C15/00 ,  B05C19/00 ,  H01L21/67 ,  B05D1/12 ,  B05B7/14

Abstract: A member includes a base material structure and a surface layer on the base material structure. The surface layer includes a particle that includes Y—O—F. The base material structure includes interface layers in contact with the surface layer. The interface layers of the base material structure include fluorine.

公开(公告)号：US20240253118A1

公开(公告)日：2024-08-01

申请号：US18416041

申请日：2024-01-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changhwan Kim ,  Takafumi Noguchi ,  Toshihiro Iizuka ,  Kenichi Nagayama

IPC: B22F3/14 ,  G01N29/14

CPC classification number: B22F3/14 ,  G01N29/14 ,  B22F2302/45 ,  B22F2999/00 ,  G01N2291/0231

Abstract: In a manufacturing method for a sintered body, a mold device including a die, first and second punches, first and second spacers, first and second rams, and a plurality of thermal resistors is used. The manufacturing method includes an operation of loading raw material powder into a cavity of the die and then sintering the raw material powder, while pressing and molding the raw material powder in the uniaxial direction using the first and second punches, to form a sintered body and an operation of cooling the formed sintered body. In the operation of cooling the formed sintered body, an acoustic emission (AE) waveform is detected from the formed sintered body, and it is determined whether a crack has occurred in the formed sintered body using the detected AE waveform.

公开(公告)号：US20210111044A1

公开(公告)日：2021-04-15

申请号：US17035023

申请日：2020-09-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHANGHWAN KIM ,  Toshihiro Iizuka ,  Kenichi Nagayawa ,  Takafumi Noguchi

IPC: H01L21/67 ,  B05D1/12 ,  B05C15/00

Abstract: A member includes a base material structure and a surface layer on the base material structure. The surface layer includes a particle that includes Y—O—F. The base material structure includes interface layers in contact with the surface layer. The interface layers of the base material structure include fluorine.