公开(公告)号：US08999497B2

公开(公告)日：2015-04-07

申请号：US13713048

申请日：2012-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kenichi Nagayama ,  Yukika Yamada ,  Hisanao Usami

IPC: B32B9/04 ,  B32B5/16 ,  H01L51/52 ,  C08J7/04

CPC classification number: B32B9/048 ,  B32B5/16 ,  C08J7/045 ,  H01L51/5256 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A barrier film for an electronic device includes: a resin film; an adsorption layer disposed on a side of the resin film and including an inorganic material, which is electrostatically chargeable with a positive charge or a negative charge and having higher hydrophilicity than a surface of the resin film; and a stacked layer disposed on a side of the adsorption layer and including a plate-shaped particle layer including an inorganic plate-shaped particle, which is electrostatically chargeable with a positive charge or a negative charge, and a binder layer including a binder particle, which is electrostatically chargeable with a positive charge or a negative charge, where the plate-shaped particle layer and binder layer are alternately stacked.

Abstract translation: 一种用于电子设备的阻挡膜包括：树脂膜; 吸附层，设置在树脂膜的一侧，并且包括无机材料，其可以用正电荷或负电荷静电充电并且具有比树脂膜的表面更高的亲水性; 以及设置在所述吸附层一侧的层叠层，其包括可以以正电荷或负电荷静电充电的包含无机板状粒子的板状粒子层和包含粘结剂粒子的粘合剂层， 该电极可以以正电荷或负电荷静电充电，其中板状颗粒层和粘合剂层交替堆叠。

公开(公告)号：US20130149513A1

公开(公告)日：2013-06-13

申请号：US13713048

申请日：2012-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kenichi Nagayama ,  Yukika Yamada ,  Hisanao Usami

IPC: B32B9/04

CPC classification number: B32B9/048 ,  B32B5/16 ,  C08J7/045 ,  H01L51/5256 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A barrier film for an electronic device includes: a resin film; an adsorption layer disposed on a side of the resin film and including an inorganic material, which is electrostatically chargeable with a positive charge or a negative charge and having higher hydrophilicity than a surface of the resin film; and a stacked layer disposed on a side of the adsorption layer and including a plate-shaped particle layer including an inorganic plate-shaped particle, which is electrostatically chargeable with a positive charge or a negative charge, and a binder layer including a binder particle, which is electrostatically chargeable with a positive charge or a negative charge, where the plate-shaped particle layer and binder layer are alternately stacked.

Abstract translation: 一种用于电子设备的阻挡膜包括：树脂膜; 吸附层，设置在树脂膜的一侧，并且包括无机材料，其可以用正电荷或负电荷静电充电并且具有比树脂膜的表面更高的亲水性; 以及设置在所述吸附层一侧的层叠层，其包括可以以正电荷或负电荷静电充电的包含无机板状粒子的板状粒子层和包含粘结剂粒子的粘合剂层， 该电极可以以正电荷或负电荷静电充电，其中板状颗粒层和粘合剂层交替堆叠。

公开(公告)号：US20240253118A1

公开(公告)日：2024-08-01

申请号：US18416041

申请日：2024-01-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changhwan Kim ,  Takafumi Noguchi ,  Toshihiro Iizuka ,  Kenichi Nagayama

IPC: B22F3/14 ,  G01N29/14

CPC classification number: B22F3/14 ,  G01N29/14 ,  B22F2302/45 ,  B22F2999/00 ,  G01N2291/0231

Abstract: In a manufacturing method for a sintered body, a mold device including a die, first and second punches, first and second spacers, first and second rams, and a plurality of thermal resistors is used. The manufacturing method includes an operation of loading raw material powder into a cavity of the die and then sintering the raw material powder, while pressing and molding the raw material powder in the uniaxial direction using the first and second punches, to form a sintered body and an operation of cooling the formed sintered body. In the operation of cooling the formed sintered body, an acoustic emission (AE) waveform is detected from the formed sintered body, and it is determined whether a crack has occurred in the formed sintered body using the detected AE waveform.

公开(公告)号：US10421059B2

公开(公告)日：2019-09-24

申请号：US14920261

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nagahisa Sato ,  Ryosuke Kamitani ,  Kenichi Nagayama ,  Tomokazu Fukuzaki

IPC: B01J20/28 ,  B01J20/04 ,  B01J20/02 ,  B01J20/06 ,  B01J20/18 ,  B01J20/32

Abstract: Example embodiments relate to a gas-adsorbing material capable of reducing the generation amount of combustible gas without deteriorating gas-adsorbing performance, and a vacuum insulation material including the gas-adsorbing material. The gas-adsorbing material may include a metal selected from at least one of Li, V, Zr, or an alloy including the same, which adsorbs a nitrogen gas and is inactivated by moisture as a nitrogen adsorbing agent, and an additive added to the metal. The metal is attached on the particle surface of the additive. The metal may be an alloy including Li and an alkaline-earth metal, for example, Ba—Li alloy. The additive absorbs moisture, and is selected from at least one of an inorganic oxide, a transition metal, an oxide of a transition metal, an alloy including a transition metal, and a mixture including a transition metal.

公开(公告)号：US20160187050A1

公开(公告)日：2016-06-30

申请号：US14981217

申请日：2015-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Makoto Odawara ,  Mitsuharu Kimura ,  Kenichi Nagayama

IPC: F25D23/06 ,  B32B27/30 ,  B32B27/32 ,  B32B15/08 ,  B32B27/36

CPC classification number: F25D23/065 ,  B32B3/28 ,  B32B7/045 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/31 ,  B32B2307/7242 ,  B32B2457/00 ,  B32B2509/00 ,  B32B2509/10 ,  B32B2607/00 ,  F16L59/026 ,  F16L59/065 ,  F25D2201/14

Abstract: A laminated structure includes a polymer layer comprising at least one layer, a gas barrier layer which has thermal resistance of greater than or equal to about 650 degrees Kelvin per watt and a Young's modulus of greater than or equal to about 100 gigapascals, and a position of a neutral axis represented by the following Equation 1 is in the gas barrier layer. y = ∑ i = 1 n   ( Ei · Si ) ∑ i = 1 n   ( Ei · Ai ) ( Equation   1 ) In Equation 1, y denotes a distance from the top surface of a side compressed in bending to the neutral axis, Ei denotes a Young's modulus of the i-th layer, Si denotes a geometrical moment of area of the i-th layer, Ai denotes a cross-sectional area of the i-th layer, and n denotes a number of layers for the laminated structure, which is an integer of greater than or equal to 5.

Abstract translation: 层压结构包括包含至少一层的聚合物层，具有大于或等于约650开尔文/瓦特的热阻和大于或等于约100吉巴兹的杨氏模量的阻气层， 由下面的等式1表示的中性轴在气体阻挡层中。 y =Σi = 1 n（Ei·Si）Σi = 1 n（Ei·Ai）（等式1）在等式1中，y表示从弯曲压缩侧的顶面的距离 Ei表示第i层的杨氏模量，Si表示第i层的面积的几何矩，Ai表示第i层的截面积，n表示第i层的横截面积， 的层叠结构的层，其为大于或等于5的整数。

公开(公告)号：US09765917B2

公开(公告)日：2017-09-19

申请号：US14979681

申请日：2015-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tomokazu Fukuzaki ,  Kenichi Nagayama ,  Mitsuharu Kimura

IPC: F16L59/065 ,  C22C30/02 ,  C22C30/00 ,  C22C18/00 ,  F16L59/08

CPC classification number: F16L59/065 ,  C22C18/00 ,  C22C30/00 ,  C22C30/02 ,  F16L59/08

Abstract: A vacuum insulation material including: a core material; and a gas adsorbing agent, wherein the core material and the gas absorbing agent are interposed between a pair of gas barrier materials, wherein at least one of the pair of gas barrier materials includes a quasicrystal metal layer including a quasicrystal metal. The vacuum insulation material may reduce the heat bridge while maintaining high gas barrier properties.

公开(公告)号：US20230174429A1

公开(公告)日：2023-06-08

申请号：US18076062

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changhwan KIM ,  Takafumi Noguchi ,  Toshihiro IIzuka ,  Younseon Wang ,  Kenichi Nagayama

IPC: C04B35/553 ,  C04B35/645

CPC classification number: C04B35/553 ,  C04B35/645 ,  C04B2235/76 ,  C04B2235/77 ,  C04B2235/445 ,  C04B2235/656 ,  C04B2235/666 ,  C04B2235/786 ,  C04B2235/5436 ,  C04B2235/5445 ,  H01L21/68757

Abstract: Provided are a sintered material having high corrosion resistance, a method of manufacturing the sintered material, a member for a semiconductor manufacturing apparatus, a method of manufacturing a member for a semiconductor manufacturing apparatus, a semiconductor manufacturing apparatus, and a method of manufacturing a semiconductor manufacturing apparatus. The sintered material according to an embodiment includes 50 mass% or more of yttrium oxyfluoride, has a relative density of 97.0% or more, and has a Vickers hardness of 5.0 GPa or more. The method of manufacturing a sintered material according to an embodiment includes forming a molded body including yttrium oxyfluoride powder having a particle size of 0.3 µm or less, and sintering the molded body under an atmospheric pressure at a temperature of 800° C. or less.

公开(公告)号：US11077419B2

公开(公告)日：2021-08-03

申请号：US15539848

申请日：2015-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nagahisa Sato ,  Ryo Iwamuro ,  Tomokazu Fukuzaki ,  Kenichi Nagayama ,  Ryosuke Kamitani ,  Kenji Takeuchi

IPC: B01J20/04 ,  F25D23/06 ,  B01J20/06 ,  F25D11/00

Abstract: Described is an adsorbent, a vacuum heat insulating material having the same and a refrigerator, which are capable of adsorbing a target material in a reduced pressure environment. A refrigerator includes an outer casing forming an exterior, an inner casing provided inside the outer casing and forming a storage chamber and a vacuum heat insulating material positioned between the outer casing and the inner casing, and including an adsorbent that adsorbs a heat transfer medium. The adsorbent includes a first adsorption component provided to adsorb oxygen, and including a transition metal oxide having an oxygen deficiency structure, and a second adsorption component provided to adsorb moisture.

公开(公告)号：US10001320B2

公开(公告)日：2018-06-19

申请号：US14981217

申请日：2015-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Makoto Odawara ,  Mitsuharu Kimura ,  Kenichi Nagayama

IPC: F25D23/06 ,  B32B27/36 ,  B32B27/32 ,  B32B27/30 ,  B32B7/04 ,  B32B7/12 ,  B32B27/08 ,  B32B27/34 ,  B32B3/28 ,  F16L59/02 ,  F16L59/065 ,  B32B15/08

CPC classification number: F25D23/065 ,  B32B3/28 ,  B32B7/05 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/31 ,  B32B2307/7242 ,  B32B2457/00 ,  B32B2509/00 ,  B32B2509/10 ,  B32B2607/00 ,  F16L59/026 ,  F16L59/065 ,  F25D2201/14

Abstract: A laminated structure includes a polymer layer comprising at least one layer, a gas barrier layer which has thermal resistance of greater than or equal to about 650 degrees Kelvin per watt and a Young's modulus of greater than or equal to about 100 gigapascals, and a position of a neutral axis represented by the following Equation 1 is in the gas barrier layer. y = ∑ i = 1 n ⁢ ⁢ ( Ei · Si ) ∑ i = 1 n ⁢ ⁢ ( Ei · Ai ) ( Equation ⁢ ⁢ 1 ) In Equation 1, y denotes a distance from the top surface of a side compressed in bending to the neutral axis, Ei denotes a Young's modulus of the i-th layer, Si denotes a geometrical moment of area of the i-th layer, Ai denotes a cross-sectional area of the i-th layer, and n denotes a number of layers for the laminated structure, which is an integer of greater than or equal to 5.

公开(公告)号：US09546481B2

公开(公告)日：2017-01-17

申请号：US14562075

申请日：2014-12-05

Applicant: Samsung Electronics Co., Ltd

Inventor： Mitsuharu Kimura ,  Hideki Imamura ,  Kenichi Nagayama

IPC: F16L59/065 ,  E04B1/78 ,  B32B5/02 ,  B32B15/08 ,  B32B27/12 ,  B32B27/34 ,  B32B27/36 ,  B32B3/04 ,  E04B1/80

CPC classification number: E04B1/78 ,  B32B3/04 ,  B32B5/022 ,  B32B15/08 ,  B32B27/12 ,  B32B27/34 ,  B32B27/36 ,  B32B2262/062 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2307/7242 ,  B32B2509/00 ,  B32B2509/10 ,  E04B1/803 ,  Y10T428/231

Abstract: A vacuum insulation material includes a pair of gas barrier exterior materials, a core material including a cellulose structure having porosity of greater than or equal to about 80% under reduced pressure of about 1 Pa, where the cellulose structure has a unit length of greater than or equal to about 1 μm and less than or equal to about 5 mm in the heat-insulation direction, and the method of manufacturing the same, and a gas adsorption agent, where the core material and the gas adsorption agent are interposed between the pair of gas barrier exterior materials and sealed inside of the pair of gas barrier exterior materials under reduced pressure.

Abstract translation: 真空绝热材料包括一对气体阻隔外部材料，芯材料包括在约1Pa的减压下孔隙率大于或等于约80％的纤维素结构，其中纤维素结构的单位长度大于 或者等于约1μm，并且在绝热方向上小于或等于约5mm，及其制造方法，以及气体吸附剂，其中芯材和气体吸附剂插入在该对之间 的气体阻隔外部材料，并在减压下密封在一对隔气外部材料的内部。