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公开(公告)号:US20240259491A1
公开(公告)日:2024-08-01
申请号:US18632754
申请日:2024-04-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehyun JO , Wooyoung KIM , Wonhee LEE , Heejun CHOI
IPC: H04M1/72466 , G06F3/0346 , G06F3/038 , G06F3/14 , H04M1/02
CPC classification number: H04M1/72466 , H04M1/0214 , H04M1/0241 , G06F3/0346 , G06F3/038 , G06F3/1431
Abstract: An electronic device is provided. The electronic device includes a first housing including a first surface and a second surface facing the first surface and spaced apart therefrom, a second housing including a third surface and a fourth surface facing the third surface and spaced apart therefrom, a folding housing which pivotably connects a side surface of the first housing and a side surface of the second housing facing the side surface of the first housing, at least one inertial sensor in at least one of the first housing and the second housing, a first display disposed on the first surface and the third surface across the folding housing, a second display disposed on the second surface or the fourth surface, memory storing one or more computer programs and one or more processors, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to while the second display is disabled in a folding state in which the first surface faces the third surface, obtain, through the at least one inertial sensor, first data indicating a posture of the electronic device and second data indicating a movement state of the electronic device, based on detecting, while identifying the electronic device being moved in a specified posture based on the first data and the second data, a specified event, change, based on a reception of a touch input on an enabled second display, a time duration in which the second display is enabled in accordance with the specified event, and based on detecting the specified event, while identifying the electronic device being moved in a posture different from the specified posture based on the first data and the second data, maintain, independently from the reception of the touch input, the time duration.
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公开(公告)号:US20240234215A9
公开(公告)日:2024-07-11
申请号:US18139674
申请日:2023-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donggap SHIN , Yongin LEE , Wooyoung KIM , Bumki MOON , Jiwon MOON , Seungdae SEOK , Siwoong WOO , Byeongtak PARK
CPC classification number: H01L22/12 , H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/08145 , H01L2224/74 , H01L2224/8001 , H01L2224/80894 , H01L2224/80908 , H01L2924/3511 , H01L2924/35121 , H01L2924/401
Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
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公开(公告)号:US20220121314A1
公开(公告)日:2022-04-21
申请号:US17427774
申请日:2019-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wooyoung KIM , Daehyun JO
Abstract: An electronic device and a method for operating the electronic device are provided. The electronic device includes a housing which includes a first surface and a second surface facing the first surface, a display which is disposed on at least a part of the first surface, a proximity sensor which is disposed between the display and the second surface, an illuminance sensor, and a processor which is operably connected to the display and the illuminance sensor, wherein the processor is configured to activate the display and the illuminance sensor in response to the occurrence of an event, measure, by using the illuminance sensor, illuminance of a region where the electronic device is disposed, confirm the characteristic of an input occurring on the display by an external object, and determine, based on the measured illuminance and the characteristic of the input, whether or not to inactivate a touch input reception function of at least a partial region of the display.
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公开(公告)号:US20250096179A1
公开(公告)日:2025-03-20
申请号:US18754738
申请日:2024-06-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wooyoung KIM , Yeonho JANG , Kimin CHEONG
IPC: H01L23/00 , H01L23/31 , H01L23/49 , H01L23/498 , H01L23/552 , H01L25/10
Abstract: A semiconductor package may include a first wiring structure including a plurality of first redistribution patterns and a plurality of first redistribution insulating layers, a second wiring structure on the first wiring structure and including a plurality of second redistribution patterns and a plurality of second redistribution insulating layers, a semiconductor chip between the first wiring structure and the second wiring structure, an expanded layer including a plurality of connection structures electrically connecting the first wiring structure and the second wiring structure to each other and an encapsulant surrounding the plurality of connection structures and the semiconductor chip, a ceramic shield layer between the expanded layer and the second wiring structure, and a plurality of via structures penetrating the ceramic shield layer and electrically connecting the plurality of connection structures and the plurality of second redistribution patterns to each other.
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公开(公告)号:US20240162135A1
公开(公告)日:2024-05-16
申请号:US18215292
申请日:2023-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jingu KIM , Yieok KWON , Wooyoung KIM , Gongje LEE , Sangkyu LEE , Bongju CHO
IPC: H01L23/498 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/31 , H01L25/00 , H01L25/065
CPC classification number: H01L23/49838 , H01L21/4857 , H01L21/56 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L23/291 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2225/06517 , H01L2225/06524 , H01L2225/06548 , H01L2924/0665
Abstract: A semiconductor package includes a lower redistribution wiring layer; and a first semiconductor device on the lower redistribution wiring layer, the first semiconductor device being connected to the lower redistribution wiring layer via conductive bumps, wherein the lower redistribution wiring layer includes: a first redistribution wire in a first lower insulating layer; an insulating structure layer having an opening that exposes a portion of the first redistribution wire, the insulating structure layer including a first photosensitive insulating layer, a light blocking layer on the first photosensitive insulating layer, and a second photosensitive insulating layer on the light blocking layer; a second redistribution wire in the opening of the insulating structure layer, the second redistribution wire including a redistribution via contacting the first redistribution wire, and a redistribution line stacked on the redistribution via; and bonding pads bonded to the conductive bumps and electrically connected to the second redistribution wire.
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公开(公告)号:US20240136231A1
公开(公告)日:2024-04-25
申请号:US18139674
申请日:2023-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Donggap SHIN , Yongin LEE , Wooyoung KIM , Bumki MOON , Jiwon MOON , Seungdae SEOK , Siwoong WOO , Byeongtak PARK
CPC classification number: H01L22/12 , H01L24/74 , H01L24/80 , H01L24/08 , H01L2224/08145 , H01L2224/74 , H01L2224/8001 , H01L2224/80894 , H01L2224/80908 , H01L2924/3511 , H01L2924/35121 , H01L2924/401
Abstract: An apparatus for measuring an adhesion force, the apparatus comprising a stage configured to support a specimen, and a sensor adhered to the specimen, wherein the sensor detects the adhesion force of the specimen, the adhesion force of the specimen being a force for detaching the sensor from the specimen.
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