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    Semiconductor package
    1.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US12300649B2

    公开(公告)日：2025-05-13

    申请号：US17702259

    申请日：2022-03-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yong Ho Kim ,  Bo In Noh ,  Jeong Hoon Ahn

    IPC: H01L23/00 ,  H01L25/065 ,  H01L25/10

    Abstract: A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.

    Electronic apparatus and method for operating same
    3.
    发明授权
    Electronic apparatus and method for operating same 有权

    公开(公告)号：US11450315B2

    公开(公告)日：2022-09-20

    申请号：US16478719

    申请日：2017-12-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong Ho Kim ,  Sourabh Pateriya ,  Sunah Kim ,  Gahyun Joo ,  Sang-Woong Hwang ,  Say Jang

    IPC: G10L15/22 ,  G06F3/16

    Abstract: Various embodiments of the disclosure disclose a method and apparatus for processing a voice recognition service in an electronic device. According to various embodiments of the disclosure, an electronic device may include a microphone, a memory, and a processor operatively coupled to the microphone and the memory. The processor may be configured to wake-up on the basis of detection of a wake-up word, process a first task corresponding to a first voice command of a user on the basis of the wake-up, set a wait time during which a follow-up command can be received on the basis of the processing of the first task, detect a second voice command of the user during the wait time, analyze a conversational context on the basis of the first voice command and second voice command, and process a second task on the basis of a result of the analysis. Various embodiments are possible.

    Semiconductor package
    5.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11600596B2

    公开(公告)日：2023-03-07

    申请号：US17196470

    申请日：2021-03-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong Ho Kim

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538

    Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 μm to 600 μm.

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