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公开(公告)号:US12300649B2
公开(公告)日:2025-05-13
申请号:US17702259
申请日:2022-03-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yong Ho Kim , Bo In Noh , Jeong Hoon Ahn
IPC: H01L23/00 , H01L25/065 , H01L25/10
Abstract: A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.
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公开(公告)号:US10020048B2
公开(公告)日:2018-07-10
申请号:US15361599
申请日:2016-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Woojin Rim , Tae Joong Song , Yong Ho Kim , Sung Hyun Park
IPC: G11C11/00 , G11C11/419 , G11C11/418 , G06F1/32 , G11C8/08
CPC classification number: G11C11/419 , G06F1/3275 , G11C8/08 , G11C11/418 , Y02D10/14
Abstract: An integrated circuit (IC) and a mobile device are provided. The IC includes a memory cell that includes a word line, a bit line pair, and a storage cell connected to the word line and the bit line pair. The IC further includes a timing control circuit configured to generate switch signals based on an operation control signal, and a switch circuit configured to receive a first voltage, a second voltage and a third voltage having different levels, and output, to the word line, one among the first voltage, the second voltage, and the third voltage based on the switch signals.
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公开(公告)号:US11450315B2
公开(公告)日:2022-09-20
申请号:US16478719
申请日:2017-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong Ho Kim , Sourabh Pateriya , Sunah Kim , Gahyun Joo , Sang-Woong Hwang , Say Jang
Abstract: Various embodiments of the disclosure disclose a method and apparatus for processing a voice recognition service in an electronic device. According to various embodiments of the disclosure, an electronic device may include a microphone, a memory, and a processor operatively coupled to the microphone and the memory. The processor may be configured to wake-up on the basis of detection of a wake-up word, process a first task corresponding to a first voice command of a user on the basis of the wake-up, set a wait time during which a follow-up command can be received on the basis of the processing of the first task, detect a second voice command of the user during the wait time, analyze a conversational context on the basis of the first voice command and second voice command, and process a second task on the basis of a result of the analysis. Various embodiments are possible.
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公开(公告)号:US11194209B2
公开(公告)日:2021-12-07
申请号:US15760577
申请日:2016-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jun Cheol Bae , Hyun Min Song , Jong Hyun Ryu , Ji Su Jung , Yong Ho Kim , Hong Suk Kim , Byung Hwa Seo , Tatsuhiro Otsuka
IPC: G02F1/137 , G02F1/133 , G02F1/1333 , G02F1/1347 , E06B9/24 , G06F3/01 , B60J3/04 , H04M1/725
Abstract: The present disclosure is directed to providing to a smart window system capable of controlling a state of a display element (e.g., at least one of transparency, color, pattern, gradation degree, and displayed information) through various kinds of input devices and a control method thereof.
In accordance with one aspect of the present disclosure, a smart window system may include a display element; an input device configured to receive a control command for the display element; and a controller configured to determine at least one of transparency, color, pattern, and gradation of the display element and information displayed on the display element on the basis of the control command.-
公开(公告)号:US11600596B2
公开(公告)日:2023-03-07
申请号:US17196470
申请日:2021-03-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong Ho Kim
IPC: H01L25/065 , H01L23/00 , H01L23/538
Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 μm to 600 μm.
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公开(公告)号:US11211048B2
公开(公告)日:2021-12-28
申请号:US16478702
申请日:2017-11-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong Ho Kim , Sourabh Pateriya , Sunah Kim , Gahyun Joo , Sang-Woong Hwang , Say Jang
Abstract: Provided are an apparatus and a method, a variety of embodiments of the apparatus comprising a microphone, memory, and a processor functionally connected to the microphone or memory, wherein the processor is configured to: count end-point detection (EPD) time on the basis of a voice input; when the EPD time expires, determine whether the final word of the voice input corresponds to a previously configured word stored in memory; and, if the final word corresponds to the previously configured word, then extend the EPD time and wait for reception of a voice input. Additionally, other embodiments are possible.
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