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    SOCKET FOR TESTING A SEMICONDUCTOR DEVICE AND TEST EQUIPMENT INCLUDING THE SAME
    1.
    发明申请
    SOCKET FOR TESTING A SEMICONDUCTOR DEVICE AND TEST EQUIPMENT INCLUDING THE SAME 有权
    用于测试半导体器件的插座和包括其的测试设备

    公开(公告)号：US20140015559A1

    公开(公告)日：2014-01-16

    申请号：US13871275

    申请日：2013-04-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngchul LEE

    IPC: G01R1/04

    CPC classification number: G01R1/0466 ,  G01R1/0416 ,  G01R31/2808 ,  G01R31/2817 ,  G11C29/56016 ,  G11C2029/5602

    Abstract: A test socket has a housing with an inlet configured to receive a substrate. A plurality of terminals are coupled to the housing, and a plurality of sliding pins are coupled to the terminals. The pins are configured to make contact with respective pads or terminals of the substrate to be tested. The pins have different lengths or positions to send and receive test signals.

    Abstract translation: 测试插座具有壳体，其具有被配置为接收衬底的入口。 多个端子耦合到壳体，并且多个滑动销耦合到端子。 引脚被配置为与要测试的基板的相应焊盘或端子接触。 引脚具有不同的长度或位置以发送和接收测试信号。

    ELECTRONIC DEVICE INCLUDING WINDOW FOR OPTICAL MODULE
    2.
    发明申请
    ELECTRONIC DEVICE INCLUDING WINDOW FOR OPTICAL MODULE 有权

    公开(公告)号：US20220394157A1

    公开(公告)日：2022-12-08

    申请号：US17702946

    申请日：2022-03-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Moohyun BAEK ,  Youngchul LEE

    IPC: H04N5/225 ,  G03B30/00

    Abstract: According to certain embodiments of the disclosure, an electronic device may include a housing, a window frame disposed in the housing and providing at least one opening exposing an inside of the housing to an outside of the housing, at least one window coupled to the window frame to close the at least one opening, and at least one optical module disposed inside the housing and configured to receive external light incident through the at least one window. The at least one window may include an inner surface facing the inside of the housing, a side surface facing an inner wall of the at least one opening, and a first inclined surface connecting the side surface to the inner surface. The first inclined surface may be inclined with respect to the inner surface and the side surface and may be bonded to the inner wall. Other various embodiments are possible as well.

    HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
    4.
    发明申请
    HEAT-RADIATING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME 有权

    公开(公告)号：US20240385665A1

    公开(公告)日：2024-11-21

    申请号：US18788715

    申请日：2024-07-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joseph AHN ,  Youngchul LEE ,  Taehyeong KIM ,  Hongki MOON ,  Jongkil PARK

    IPC: G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  H05K1/02 ,  H05K7/20

    Abstract: An electronic device is provided. The electronic device includes a housing, a display disposed in the housing, a support member configured to support the display and including a first surface facing the display, a second surface facing the opposite direction to the first surface, and a first opening formed to penetrate at least one portion of the first surface and the second surface, a battery disposed on the second surface of the support member, wherein at least one portion of the battery faces the first opening, a printed circuit board disposed on the second surface of the support member and spaced from the battery, and a heat-radiating member configured to mediate heat transfer between the display and the printed circuit board, and including a first area and a second area coupled to the first area, wherein the first area is at least partially disposed to overlap the first surface, wherein the second area is at least partially disposed in the first opening, and wherein the at least a portion of the first area is coupled to the support member by laser welding.

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