公开(公告)号：US20240170552A1

公开(公告)日：2024-05-23

申请号：US18215254

申请日：2023-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungbin Chun ,  Jinbum Kim ,  Gyeom Kim ,  Dahye Kim ,  Youngkwang Kim

IPC: H01L29/423 ,  H01L29/06 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/42392 ,  H01L29/0673 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device including channels spaced apart from each other on a substrate; a gate structure extending on the substrate, the gate structure surrounding lower and upper surfaces and sidewalls of each of the channels; and a source/drain layer on the substrate, the source/drain layer contacting sidewalls of the channels and containing silicon-germanium, the source/drain layer including: a second epitaxial layer having a second germanium concentration; and a first epitaxial layer having a first germanium concentration smaller than the second germanium concentration, the first epitaxial layer covering a lower surface and sidewalls of the second epitaxial layer, wherein the first epitaxial layer includes a protruding portion that protrudes in the first direction and contacts the gate structure, and wherein the protruding portion has a facet that is not curved.