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公开(公告)号：US11780048B2
公开(公告)日：2023-10-10
申请号：US16869233
申请日：2020-05-07
Applicant: Seagate Technology LLC
Inventor： Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/005 , B24B37/12 , B24B53/017 , B24B37/04
CPC classification number: B24B37/12 , B24B37/005 , B24B37/04 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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公开(公告)号：US20210268625A1
公开(公告)日：2021-09-02
申请号：US17320571
申请日：2021-05-14
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Chea Phann , Kevin Lamber Mayer , Ricky Ray Anderson , Andrew David Habermas
IPC: B24B53/017 , B24B37/20 , B24B27/00 , B24B37/12 , B24B53/12
Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
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公开(公告)号：US10654146B2
公开(公告)日：2020-05-19
申请号：US15877615
申请日：2018-01-23
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Ricky Ray Anderson , Andrew David Habermas , Chea Phann
Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.
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4.发明公开公开(公告)号：US20230405757A1
公开(公告)日：2023-12-21
申请号：US18240134
申请日：2023-08-30
Applicant: Seagate Technology LLC
Inventor： Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
CPC classification number: B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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5.发明申请公开(公告)号：US20200262025A1
公开(公告)日：2020-08-20
申请号：US16869233
申请日：2020-05-07
Applicant: Seagate Technology LLC
Inventor： Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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Patent Agency Ranking
公开(公告)号：US10682737B2
公开(公告)日：2020-06-16
申请号：US15198566
申请日：2016-06-30
Applicant: Seagate Technology LLC
Inventor： Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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公开(公告)号：US11826881B2
公开(公告)日：2023-11-28
申请号：US17320571
申请日：2021-05-14
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Chea Phann , Kevin Lamber Mayer , Ricky Ray Anderson , Andrew David Habermas
IPC: B24B53/017 , B24B53/12 , B24B37/12 , B24B37/20 , B24B27/00
CPC classification number: B24B53/017 , B24B27/0076 , B24B37/12 , B24B37/20 , B24B53/12
Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
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公开(公告)号：US11020838B2
公开(公告)日：2021-06-01
申请号：US15693837
申请日：2017-09-01
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Chea Phann , Kevin Lamber Mayer , Ricky Ray Anderson , Andrew David Habermas
IPC: B24B53/017 , B24B53/12 , B24B37/12 , B24B37/20 , B24B27/00
Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
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9.发明申请公开(公告)号：US20190224806A1
公开(公告)日：2019-07-25
申请号：US15877615
申请日：2018-01-23
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Ricky Ray Anderson , Andrew David Habermas , Chea Phann
Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.
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10.发明申请公开(公告)号：US20190070709A1
公开(公告)日：2019-03-07
申请号：US15693837
申请日：2017-09-01
Applicant: Seagate Technology LLC
Inventor： Mihaela Ruxandra Baurceanu , Chea Phann , Kevin Lamber Mayer , Ricky Ray Anderson , Andrew David Habermas
IPC: B24B53/017 , B24B37/20
Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
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