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1.发明公开公开(公告)号：US20230201976A1
公开(公告)日：2023-06-29
申请号：US18117754
申请日：2023-03-06
CPC分类号： B23K35/262 , B23K35/0233 , B23K35/3033 , C22C13/00 , C22C19/03
摘要： Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
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公开(公告)号：US20160056570A1
公开(公告)日：2016-02-25
申请号：US14782142
申请日：2014-04-03
CPC分类号： H01R13/58 , B23K35/0222 , B23K35/26 , B23K35/262 , B23K2101/36 , B23K2101/42 , C22C13/00 , C22C13/02 , H01R4/02 , H01R12/71
摘要： With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.
摘要翻译： 随着车载电子电路密度的增加，不仅在基板和焊料附着部位之间的接合界面处的常规裂纹或部件和焊料附着位置，而且还存在Sn基体中出现裂纹的新颖裂纹问题 粘合焊料的内部已经出现。 为了解决上述问题，使用了具有1-4质量％Ag，0.6-0.8质量％Cu，1-5质量％Sb，0.01-0.2质量％Ni和余量为Sn的无铅焊料合金。 一种焊料合金，它不仅可以承受从-40°C的低温到125°C的高温的恶劣温度循环特性，而且还可以承受在爬上路边或与车辆碰撞时发生的外力 可以得到长时间的前方以及使用焊料合金的车载电子电路装置。
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公开(公告)号：US20230364721A1
公开(公告)日：2023-11-16
申请号：US18138267
申请日：2023-04-24
发明人： Yoshie TACHIBANA , Hiroshi KAWANAGO , Takashi AKAGAWA , Satoshi MASUDA , Masaki SUGIYAMA , Yosuke KAZUMOTO , Hisaya SUGIMOTO , Hiroaki HATSUYAMA
IPC分类号： B23K35/36
CPC分类号： B23K35/3602 , B23K35/3617
摘要： A brazing paste contain a brazing material in an amount of 80% by mass or more and 95% by mass or less; and a binder in an amount of 5% by mass or more and 20% by mass or less. The brazing material contains a flux in an amount of 2% by mass or more and 5% by mass or less. The binder contains a solid solvent containing two or more hydroxyl groups and having 8 to 10 carbon atoms, and a liquid solvent. When the binder does not contain a thixotropic agent, the liquid solvent is contained in an amount of 68% by mass or more with respect to a total of the binder, and when the binder contains a thixotropic agent, the thixotropic agent is contained in an amount of 11% by mass or less with respect to a total of the binder.
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公开(公告)号：US20230364720A1
公开(公告)日：2023-11-16
申请号：US18142736
申请日：2023-05-03
发明人： Yoshie TACHIBANA , Hiroshi KAWANAGO , Takashi AKAGAWA , Satoshi MASUDA , Masaki SUGIYAMA , Yosuke KAZUMOTO , Hisaya SUGIMOTO , Hiroaki HATSUYAMA
CPC分类号： B23K35/025 , B23K35/3612 , B23K35/302 , B23K35/3053
摘要： A brazing paste contain 80% by mass or more and 95% by mass or less of a brazing material; and 5% by mass or more and 20% by mass or less of a binder. The binder contains a solid solvent containing two or more hydroxyl groups and having 5 to 7 carbon atoms, and a liquid solvent.
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5.发明申请公开(公告)号：US20220324062A1
公开(公告)日：2022-10-13
申请号：US17706965
申请日：2022-03-29
摘要： Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).
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公开(公告)号：US20200284282A1
公开(公告)日：2020-09-10
申请号：US16759625
申请日：2018-10-30
发明人： Minoru UESHIMA , Yoshie TACHIBANA
摘要： A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.
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