公开(公告)号：US20190067495A1

公开(公告)日：2019-02-28

申请号：US15689135

申请日：2017-08-29

Applicant: SensL Technologies Ltd.

Inventor： Paul Malachy Daly ,  John Carlton Jackson

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/024 ,  H01L31/107 ,  H01L31/0224

CPC classification number: H01L31/02027 ,  G01T1/248 ,  H01L25/162 ,  H01L25/167 ,  H01L27/1446 ,  H01L31/02005 ,  H01L31/022408 ,  H01L31/024 ,  H01L31/03529 ,  H01L31/107 ,  H01L2224/131 ,  H01L2924/12043 ,  H01L2924/1207

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising an array of interconnected microcells; wherein the array comprises at least a first type of microcell having a first junction region of a first geometric shape; and a second type of microcell having a second junction region of a second geometric shape.

公开(公告)号：US10580909B2

公开(公告)日：2020-03-03

申请号：US15689135

申请日：2017-08-29

Applicant: SensL Technologies Ltd.

Inventor： Paul Malachy Daly ,  John Carlton Jackson

IPC: H01L31/107 ,  H01L31/02 ,  H01L25/16 ,  H01L31/024 ,  H01L31/0224 ,  G01T1/24 ,  H01L27/144 ,  H01L31/0352

Abstract: The present disclosure relates to a semiconductor photomultiplier comprising an array of interconnected microcells; wherein the array comprises at least a first type of microcell having a first junction region of a first geometric shape; and a second type of microcell having a second junction region of a second geometric shape.

公开(公告)号：US10205033B1

公开(公告)日：2019-02-12

申请号：US15841895

申请日：2017-12-14

Applicant: SensL Technologies Ltd.

Inventor： Paul Malachy Daly ,  John Carlton Jackson ,  Brian McGarvey ,  Stephen Bellis

IPC: H01L31/02 ,  H01L27/02 ,  H01L27/144 ,  H01L31/18 ,  H01L31/107 ,  H01L31/00 ,  H01L23/60 ,  H01L23/62

Abstract: The present disclosure relates to a semiconductor photomultiplier which comprises one or more microcells on a substrate having at least one terminal. At least one ESD protection element is operably coupled to the at least one terminal.