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公开(公告)号:US09659980B2
公开(公告)日:2017-05-23
申请号:US14801592
申请日:2015-07-16
Applicant: SensL Technologies Ltd
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/144 , H01L31/02 , H01L31/107 , H01L31/024 , H01L25/16 , H01L23/00 , H01L23/48
CPC classification number: H01L27/1446 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/94 , H01L25/162 , H01L25/167 , H01L27/1443 , H01L31/02005 , H01L31/02019 , H01L31/02027 , H01L31/024 , H01L31/107 , H01L2224/131 , H01L2224/16145 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/4912 , H01L2224/73257 , H01L2224/94 , H01L2924/00014 , H01L2924/12043 , H01L2924/1205 , H01L2924/1207 , H01L2924/1304 , H01L2924/014 , H01L2224/81 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.
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公开(公告)号:US20160181293A1
公开(公告)日:2016-06-23
申请号:US14801592
申请日:2015-07-16
Applicant: SensL Technologies Ltd
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/144 , H01L31/107 , H01L23/00 , H01L25/16 , H01L23/48 , H01L31/02 , H01L31/024
CPC classification number: H01L27/1446 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/94 , H01L25/162 , H01L25/167 , H01L27/1443 , H01L31/02005 , H01L31/02019 , H01L31/02027 , H01L31/024 , H01L31/107 , H01L2224/131 , H01L2224/16145 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/4912 , H01L2224/73257 , H01L2224/94 , H01L2924/00014 , H01L2924/12043 , H01L2924/1205 , H01L2924/1207 , H01L2924/1304 , H01L2924/014 , H01L2224/81 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.
Abstract translation: 本公开涉及一种包括基板的半导体光电倍增管; 在基板上形成的可操作地耦合在阳极和阴极之间的光敏电池阵列。 提供了一组主要总线线路,每条主线路与相应的感光单元组相关联。 辅助总线线路耦合到一组主要总线线路。 提供电导体,其具有耦合到次级总线上的相应连接位置的多个连接位置,用于提供具有比次级总线更低阻抗的导电路径。
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公开(公告)号:US11056525B2
公开(公告)日:2021-07-06
申请号:US15335658
申请日:2016-10-27
Applicant: SensL Technologies LTD
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/144 , H01L23/48 , H01L27/146 , H01L31/107 , H01L49/02 , G01J1/44
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.
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公开(公告)号:US20170236852A1
公开(公告)日:2017-08-17
申请号:US15582158
申请日:2017-04-28
Applicant: SensL Technologies Ltd
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/144 , H01L23/00 , H01L31/107 , H01L25/16 , H01L31/02 , H01L31/024
CPC classification number: H01L27/1446 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/94 , H01L25/162 , H01L25/167 , H01L27/1443 , H01L31/02005 , H01L31/02019 , H01L31/02027 , H01L31/024 , H01L31/107 , H01L2224/131 , H01L2224/16145 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/4912 , H01L2224/73257 , H01L2224/94 , H01L2924/00014 , H01L2924/12043 , H01L2924/1205 , H01L2924/1207 , H01L2924/1304 , H01L2924/014 , H01L2224/81 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.
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公开(公告)号:US10276610B2
公开(公告)日:2019-04-30
申请号:US15582158
申请日:2017-04-28
Applicant: SensL Technologies Ltd
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/14 , H01L27/144 , H01L31/02 , H01L31/107 , H01L31/024 , H01L25/16 , H01L23/00 , H01L23/48
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a substrate; an array of photosensitive cells formed on the substrate that are operably coupled between an anode and a cathode. A set of primary bus lines are provided each being associated with a corresponding set of photosensitive cells. A secondary bus line is coupled to the set of primary bus lines. An electrical conductor is provided having a plurality of connection sites coupled to respective connection locations on the secondary bus line for providing conduction paths which have lower impedance than the secondary bus line.
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公开(公告)号:US10205033B1
公开(公告)日:2019-02-12
申请号:US15841895
申请日:2017-12-14
Applicant: SensL Technologies Ltd.
Inventor: Paul Malachy Daly , John Carlton Jackson , Brian McGarvey , Stephen Bellis
IPC: H01L31/02 , H01L27/02 , H01L27/144 , H01L31/18 , H01L31/107 , H01L31/00 , H01L23/60 , H01L23/62
Abstract: The present disclosure relates to a semiconductor photomultiplier which comprises one or more microcells on a substrate having at least one terminal. At least one ESD protection element is operably coupled to the at least one terminal.
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公开(公告)号:US20170047372A1
公开(公告)日:2017-02-16
申请号:US15335658
申请日:2016-10-27
Applicant: SensL Technologies LTD
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/146 , H01L31/107 , H01L49/02
CPC classification number: H01L27/14643 , H01L23/481 , H01L27/1446 , H01L27/14603 , H01L27/14609 , H01L27/14634 , H01L27/14636 , H01L28/20 , H01L31/107
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.
Abstract translation: 本公开涉及一种包括基板的半导体光电倍增管; 形成在所述基板的第一主表面上的感光元件阵列; 将所述感光元件相互连接的多条初级总线; 设置在所述基板的第二主表面上的至少一个分段次级总线,其可操作地耦合到一个或多个端子; 以及延伸穿过所述基板的多个垂直互连接入(通孔),其可操作地将所述主总线线路耦合到所述至少一个分段次级总线线路。
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公开(公告)号:US20160181302A1
公开(公告)日:2016-06-23
申请号:US14577123
申请日:2014-12-19
Applicant: SensL Technologies Ltd
Inventor: Brian McGarvey , Stephen John Bellis , John Carlton Jackson
IPC: H01L27/146 , H01L31/107
CPC classification number: H01L27/14643 , H01L23/481 , H01L27/1446 , H01L27/14603 , H01L27/14609 , H01L27/14634 , H01L27/14636 , H01L28/20 , H01L31/107
Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coulping the primary bus lines to the at least one segmented secondary bus line.
Abstract translation: 本公开涉及一种包括基板的半导体光电倍增管; 形成在所述基板的第一主表面上的感光元件阵列; 将所述感光元件相互连接的多条初级总线; 设置在所述基板的第二主表面上的至少一个分段次级总线,其可操作地耦合到一个或多个端子; 以及延伸穿过所述衬底的多个垂直互连接入(通孔),其可操作地将所述主要总线线路连接到所述至少一个分段的次级总线线路。
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