Semiconductor photomultiplier
    3.
    发明授权

    公开(公告)号:US11056525B2

    公开(公告)日:2021-07-06

    申请号:US15335658

    申请日:2016-10-27

    Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.

    Semiconductor Photomultiplier
    7.
    发明申请
    Semiconductor Photomultiplier 审中-公开
    半导体光电倍增管

    公开(公告)号:US20170047372A1

    公开(公告)日:2017-02-16

    申请号:US15335658

    申请日:2016-10-27

    Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.

    Abstract translation: 本公开涉及一种包括基板的半导体光电倍增管; 形成在所述基板的第一主表面上的感光元件阵列; 将所述感光元件相互连接的多条初级总线; 设置在所述基板的第二主表面上的至少一个分段次级总线,其可操作地耦合到一个或多个端子; 以及延伸穿过所述基板的多个垂直互连接入(通孔),其可操作地将所述主总线线路耦合到所述至少一个分段次级总线线路。

    SEMICONDUCTOR PHOTOMULTIPLIER
    8.
    发明申请

    公开(公告)号:US20160181302A1

    公开(公告)日:2016-06-23

    申请号:US14577123

    申请日:2014-12-19

    Abstract: The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coulping the primary bus lines to the at least one segmented secondary bus line.

    Abstract translation: 本公开涉及一种包括基板的半导体光电倍增管; 形成在所述基板的第一主表面上的感光元件阵列; 将所述感光元件相互连接的多条初级总线; 设置在所述基板的第二主表面上的至少一个分段次级总线,其可操作地耦合到一个或多个端子; 以及延伸穿过所述衬底的多个垂直互连接入(通孔),其可操作地将所述主要总线线路连接到所述至少一个分段的次级总线线路。

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