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公开(公告)号：US12107101B2
公开(公告)日：2024-10-01
申请号：US17546740
申请日：2021-12-09
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
IPC: H01L27/146 , H01L25/16
CPC classification number: H01L27/14618 , H01L25/167 , H01L27/1462 , H01L27/14627 , H01L27/14636
Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.
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公开(公告)号：US11791553B2
公开(公告)日：2023-10-17
申请号：US17425572
申请日：2020-08-24
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Qinyi Duan , Qiongqin Mao
CPC classification number: H01Q3/36
Abstract: A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.
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3.发明授权公开(公告)号：US11581196B2
公开(公告)日：2023-02-14
申请号：US16913020
申请日：2020-06-26
Inventor： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC: H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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公开(公告)号：US09946132B2
公开(公告)日：2018-04-17
申请号：US15485631
申请日：2017-04-12
Inventor： Zhaokeng Cao , Dandan Qin , Tingting Cui
IPC: G02F1/1333 , G02F1/1335 , G02F1/1362 , G02F1/1343 , G02F1/1368
CPC classification number: G02F1/136286 , G02F1/1309 , G02F1/133514 , G02F1/134309 , G02F2001/136254
Abstract: An array substrate and a liquid crystal display panel including the array substrate are provided. The array substrate includes: multiple pixel units; at least one additional functional area located in each row of a matrix formed by the multiple pixel units, where the additional functional area is provided with a gate signal detecting transistor; and a detection signal output line and a preset signal line connected with each other. By detecting whether a drive signal on a gate line is normal using the gate signal detecting transistor, the problem of manually detecting one-by one whether a signal on a gate line is normal can be avoided, thereby improving the detection efficiency and accuracy.
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公开(公告)号：US09625781B2
公开(公告)日：2017-04-18
申请号：US14711967
申请日：2015-05-14
Inventor： Zhaokeng Cao , Dandan Qin , Tingting Cui
IPC: G02F1/1362 , G02F1/1345
CPC classification number: G02F1/136286 , G02F1/13452
Abstract: The present disclosure relates to an array substrate, a display panel and a display device. The array substrate includes a display area and a peripheral area surrounding the display area. The peripheral area includes a gate drive circuit which is electrically connected to a plurality of signal lines so as to provide the scanning signals to the display area. The display area includes a plurality of sub-pixels arranged in an array pattern and at least one wiring areas disposed between the sub-pixels, at least one signal line which is electrically connected to the gate drive circuit is provided in the at least one wiring areas.
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Patent Agency Ranking
6.发明授权公开(公告)号：US11334740B2
公开(公告)日：2022-05-17
申请号：US16910840
申请日：2020-06-24
Inventor： Kerui Xi , Tingting Cui , Feng Qin , Xuhui Peng , Linzhi Wang
Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US09455277B2
公开(公告)日：2016-09-27
申请号：US14723227
申请日：2015-05-27
Inventor： Zhaokeng Cao , Dandan Qin , Tingting Cui , Kerui Xi
IPC: G02F1/133 , H01L27/12 , G02F1/1368 , G02F1/1362 , G02F1/1335
CPC classification number: H01L27/124 , G02F1/13306 , G02F1/133382 , G02F1/133514 , G02F1/136286 , G02F1/1368 , G02F2201/40 , G09G3/20 , G09G2300/0426 , G09G2300/043 , G09G2320/041 , H01L27/1218 , H01L27/1255
Abstract: An array substrate includes a substrate, a plurality of gate lines and a plurality of data lines intersecting each other and being insulating from each other, and a plurality of pixel units arranged in an array and surrounded by the intersecting gate lines and data lines. The array substrate also includes at least one temperature measuring unit and at least one gate signal start control line. The temperature measuring unit includes at least one thin film transistor. The array substrate further includes a signal input line, a signal output line, and resistor is arranged on the signal input line. The temperature measuring unit includes a first terminal electrically connected with the signal input line and a second terminal electrically connected with the signal output line.
Abstract translation: 阵列基板包括彼此相交并彼此绝缘的基板，多条栅极线和多条数据线，以及排列成阵列并被相交的栅极线和数据线围绕的多个像素单元。 阵列基板还包括至少一个温度测量单元和至少一个栅极信号起始控制线。 温度测量单元包括至少一个薄膜晶体管。 阵列基板还包括信号输入线，信号输出线和电阻器，布置在信号输入线上。 温度测量单元包括与信号输入线电连接的第一端子和与信号输出线路电连接的第二端子。
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公开(公告)号：US10515597B2
公开(公告)日：2019-12-24
申请号：US15867061
申请日：2018-01-10
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Tingting Cui , Kerui Xi , Yumin Han
IPC: G09G3/36 , G02F1/1335
Abstract: A display device and a driving method thereof are provided. The display device has a display panel and a field-sequential backlight module arranged opposite to the display panel. The display panel includes a light incident surface and a light exit surface arranged opposite to the light incident surface. The field-sequential backlight module is disposed at a side of the display panel close to the light incident surface, and includes a plurality of light sources of three different colors. The display panel include a first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer sandwiched between the first substrate and the second substrate. The liquid crystal layer is configured to enable the display device to switch between an opaque or translucent state and a transparent state without introducing any polarizers to the display device.
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公开(公告)号：US20160126257A1
公开(公告)日：2016-05-05
申请号：US14723227
申请日：2015-05-27
Inventor： Zhaokeng CAO , Dandan Qin , Tingting Cui , Kerui Xi
IPC: H01L27/12 , G02F1/1335 , G02F1/1362 , H01L23/34 , G02F1/1368
CPC classification number: H01L27/124 , G02F1/13306 , G02F1/133382 , G02F1/133514 , G02F1/136286 , G02F1/1368 , G02F2201/40 , G09G3/20 , G09G2300/0426 , G09G2300/043 , G09G2320/041 , H01L27/1218 , H01L27/1255
Abstract: An array substrate includes a substrate, a plurality of gate lines and a plurality of data lines intersecting each other and being insulating from each other, and a plurality of pixel units arranged in an array and surrounded by the intersecting gate lines and data lines. The array substrate also includes at least one temperature measuring unit and at least one gate signal start control line. The temperature measuring unit includes at least one thin film transistor. The array substrate further includes a signal input line, a signal output line, and resistor is arranged on the signal input line. The temperature measuring unit includes a first terminal electrically connected with the signal input line and a second terminal electrically connected with the signal output line.
Abstract translation: 阵列基板包括彼此相交并彼此绝缘的基板，多条栅极线和多条数据线，以及排列成阵列并被相交的栅极线和数据线围绕的多个像素单元。 阵列基板还包括至少一个温度测量单元和至少一个栅极信号起始控制线。 温度测量单元包括至少一个薄膜晶体管。 阵列基板还包括信号输入线，信号输出线和电阻器，布置在信号输入线上。 温度测量单元包括与信号输入线电连接的第一端子和与信号输出线路电连接的第二端子。
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公开(公告)号：US12057324B2
公开(公告)日：2024-08-06
申请号：US18090918
申请日：2022-12-29
Inventor： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC: H01L21/48 , H01L21/56 , H01L23/00 , H01L23/498
CPC classification number: H01L21/4853 , H01L21/486 , H01L21/4896 , H01L21/561 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2924/37001
Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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