-
公开(公告)号:US20240170589A1
公开(公告)日:2024-05-23
申请号:US18430848
申请日:2024-02-02
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor: Fan XU , Bin ZHOU , Haotian LU , Kaidi ZHANG , Linzhi WANG , Zhen LIU , Baiquan LIN , Kerui XI
IPC: H01L31/0232 , H01L27/144 , H01L31/113
CPC classification number: H01L31/02325 , H01L27/1446 , H01L31/1136
Abstract: Provided are a photoelectric sensor and an electronic device. The photoelectric sensor includes a substrate, a plurality of photoelectric sensing elements, and a wall structure between two adjacent photoelectric sensing elements. The wall structure includes a first layer and a second layer stacked with the first layer. The first layer is arranged at a side of the second layer away from the substrate and includes a light-blocking material. At least one of the first layer or the second layer of the wall structure is arranged in a same layer as at least one layer of the photoelectric sensing element.
-
2.
公开(公告)号:US20230271397A1
公开(公告)日:2023-08-31
申请号:US17826823
申请日:2022-05-27
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor: Zhen LIU , Qingsan ZHU , Kerui XI , Xiaobing ZHAO , Huan LI , Fan XU , Danping WANG , Feng QIN
IPC: B32B3/08
Abstract: A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.
-
3.
公开(公告)号:US20240176174A1
公开(公告)日:2024-05-30
申请号:US18126004
申请日:2023-03-24
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor: Zhen LIU , Qingsan ZHU , Xiaobing ZHAO , Dongzhen ZHANG , Fan XU , Danping WANG , Kerui XI , Feng QIN
IPC: G02F1/1333 , G02F1/1335 , G02F1/1339 , G02F1/1347
CPC classification number: G02F1/133305 , G02F1/1335 , G02F1/1339 , G02F1/1347
Abstract: A flexible dimming device and its fabrication method, a glass assembly, an automobile, and a glass curtain wall. The flexible dimming device includes: a first flexible substrate and a second flexible substrate opposite to each other; a liquid crystal layer sandwiched between the first flexible substrate and the second flexible substrate where the liquid crystal layer includes guest-host liquid crystals and dye molecules; a first electrode and a second electrode; and an anti-ultraviolet film on a side of the first flexible substrate away from the second flexible substrate. The first electrode is located on a side of the first flexible substrate close to the liquid crystal layer and the second electrode is located on a side of the second flexible substrate close to the liquid crystal layer. The anti-ultraviolet film and the first flexible substrate are bonded by a first adhesive film.
-
公开(公告)号:US20240128283A1
公开(公告)日:2024-04-18
申请号:US18090202
申请日:2022-12-28
Applicant: Shanghai Tianma Micro-electronics Co., Ltd.
Inventor: Haotian LU , Linzhi WANG , Baiquan LIN , Kerui XI , Shun GONG , Yukun HUANG , Fan XU , Kaidi ZHANG
IPC: H01L27/146 , G01N21/64
CPC classification number: H01L27/14603 , G01N21/645 , G01N21/6428
Abstract: A detection substrate including a substrate and a plurality of detection units disposed on a side of the substrate, each detection unit including at least an inorganic transistor, an organic transistor, and a photoelectric sensor element, the organic transistor including an organic semiconductor part, in a direction perpendicular to a plane of the substrate, a film layer where the organic semiconductor part is located being located on the side of the film layer where the inorganic transistor is located away from the substrate, the film layer where the organic semiconductor part is located being located on the side of a film layer where the photoelectric sensor element is located away from the substrate, the organic transistor of the detection unit being connected to a sensing electrode, the sensing electrode being located on the side of the film layer where the inorganic transistor is located away from the substrate.
-
-
-