公开(公告)号：US20200026066A1

公开(公告)日：2020-01-23

申请号：US16184303

申请日：2018-11-08

Applicant: SILICON LIGHT MACHINES CORPORATION

Inventor： Alexander PAYNE

IPC: G02B26/08 ,  B22F3/105 ,  B29C64/135 ,  B29C64/268 ,  B33Y30/00

Abstract: A spatial light modulator (SLM) having improved &endue, and methods of fabricating and operating the same are described. Generally, the SLM includes pixels each including a tensile membrane suspended over a surface of a substrate by posts at corners thereof. The tensile membrane includes an electrostatically deflectable piston and flexures through which the piston is coupled to the posts. A platform having first light reflective surfaces is supported above and separated from the piston by one or more central posts extending from the piston to the platform, and a face-plate including a second light reflective surface is suspended over the platform. The face-plate includes plurality of apertures through which the first light reflective surfaces are exposed. Electrostatic deflection of the piston brings light reflected from the first light reflective surfaces into constructive or destructive interference with light reflected from the second light reflective surface. Other embodiments are also described.

公开(公告)号：US20130034958A1

公开(公告)日：2013-02-07

申请号：US13648932

申请日：2012-10-10

Applicant: Silicon Light Machines Corporation

Inventor： Joshua LU ,  Gregory BEACH ,  Alexander PAYNE ,  James HUNTER

IPC: H01L21/768

CPC classification number: G02B26/0808 ,  B81B2201/047 ,  B81C1/00238 ,  B81C1/00246 ,  G02B26/0833

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract translation: 提供了一种制造包括微电子机械系统（MEMS）和相关微电路的集成装置的方法。 在一个实施例中，该方法包括：通过电介质层形成高温接触到邻近微电子机械系统（MEMS）结构的衬底上形成的微电路的下层元件; 以及在所述电介质层上沉积导电材料层，以及图案化所述导电材料层以形成用于所述微电路的局部互连（L1），所述微电路覆盖并电耦合到所述触点和所述相邻MEMS结构的底部电极。 还提供了其他实施例。

公开(公告)号：US20200247052A1

公开(公告)日：2020-08-06

申请号：US16780543

申请日：2020-02-03

Applicant: SILICON LIGHT MACHINES CORPORATION

Inventor： Alexander PAYNE ,  Lars ENG ,  James Hunter

IPC: B29C64/268 ,  G02B26/08 ,  G02B26/06 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/135 ,  B29C64/153 ,  B29C64/277

Abstract: A spatial light modulator (SLM) including a two-dimensional (2D) array of n rows of m pixels, and a stacked drive circuit including at least one, one-dimensional (1D) array of n*m drivers monolithically integrated on the same substrate and methods of fabricating and methods of using the same in materials processing applications are provided. Generally, each pixel includes at least one modulator, and is configured to modulate light incident thereon in response to drive signals received from the stacked drive circuit. The 1D array of the stacked drive circuit includes a single row of n*m drivers arranged adjacent to and laterally separated from the 2D array of pixels. Other embodiments are also described.