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公开(公告)号：US10764995B2
公开(公告)日：2020-09-01
申请号：US15867924
申请日：2018-01-11
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Chun-Lung Chen
Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.
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2.发明申请公开(公告)号：US20180139844A1
公开(公告)日：2018-05-17
申请号：US15431834
申请日：2017-02-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You
Abstract: An electronic device is provided, including a substrate, a first circuit portion and a second circuit portion formed on the substrate, and an electronic component having a first portion disposed on the first circuit portion and a second portion disposed on the second circuit portion. The first circuit portion differs in circuit specification from the second circuit portion. Therefore, the present disclosure eliminates the need to fabricate all circuit layers under fine trace specification, thereby effectively reducing the cost.
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Patent Agency Ranking
公开(公告)号：US20210018360A1
公开(公告)日：2021-01-21
申请号：US16585409
申请日：2019-09-27
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Cheng-Kai Chang
Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.
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公开(公告)号：US11143549B2
公开(公告)日：2021-10-12
申请号：US16585409
申请日：2019-09-27
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Cheng-Kai Chang
Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.
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公开(公告)号：US20160128184A1
公开(公告)日：2016-05-05
申请号：US14833101
申请日：2015-08-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Chun-Lung Chen
CPC classification number: H05K1/0271 , H05K3/007 , H05K3/184 , H05K3/4682 , H05K2201/0187 , H05K2201/096 , H05K2203/0709
Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.
Abstract translation: 提供了一种用于制造衬底结构的方法，其包括以下步骤：在载体上设置至少一个加强构件; 在所述载体上依次形成第一电路层和电介质层，其中所述强化构件嵌入在所述电介质层中; 在所述电介质层上形成第二电路层; 移除载体; 以及在所述第一电路层和所述第二电路层上形成绝缘层。 加强构件有助于减少基底结构的热翘曲。
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公开(公告)号：US20180139840A1
公开(公告)日：2018-05-17
申请号：US15867924
申请日：2018-01-11
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Chun-Lung Chen
CPC classification number: H05K1/0271 , H05K3/007 , H05K3/184 , H05K3/4682 , H05K2201/0187 , H05K2201/096 , H05K2203/0709
Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.
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公开(公告)号：US09907161B2
公开(公告)日：2018-02-27
申请号：US14833101
申请日：2015-08-23
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jin-Wei You , Chun-Lung Chen
CPC classification number: H05K1/0271 , H05K3/007 , H05K3/184 , H05K3/4682 , H05K2201/0187 , H05K2201/096 , H05K2203/0709
Abstract: A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure.
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