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公开(公告)号：US11239125B2
公开(公告)日：2022-02-01
申请号：US16232735
申请日：2018-12-26
发明人： Hsien-Lung Hsiao , Yu-Cheng Pai , Chia-Chi Lo , Szu-Hsien Chen , Shu-Chi Chang
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00 , H01L23/60
摘要： A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
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公开(公告)号：US20200035573A1
公开(公告)日：2020-01-30
申请号：US16232735
申请日：2018-12-26
发明人： Hsien-Lung Hsiao , Yu-Cheng Pai , Chia-Chi Lo , Szu-Hsien Chen , Shu-Chi Chang
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00
摘要： A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.
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公开(公告)号：US20200328142A1
公开(公告)日：2020-10-15
申请号：US16538286
申请日：2019-08-12
发明人： Don-Son Jiang , Nai-Hao Kao , Chih-Sheng Lin , Szu-Hsien Chen , Chih-Yuan Shih , Chia-Cheng Chen , Yu-Cheng Pai , Hsuan-Hao Mi
IPC分类号： H01L23/498 , H01L23/14 , H01L23/367 , H01L23/00 , H01L21/48
摘要： A package stack structure and a method for fabricating the same are provided. An electronic component is disposed on the topmost one of a plurality of organic material substrates, and no chip is disposed on the remaining organic material substrates. A predefined layer number of circuit layers are disposed in the organic material substrates, and distributes the thermal stress via the organic material substrates. Therefore, the bottommost one of the organic material substrates will not be separated from a circuit board due to CTE mismatch. Also a carrier component is provided.
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