-
公开(公告)号：US20180294402A1
公开(公告)日：2018-10-11
申请号：US15922685
申请日：2018-03-15
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Hikaru SHIMOMURA , Naoki TAKAHASHI , Yuki ENDO , Kota OKUBO
IPC: H01L41/09 , H01L41/047 , H03H9/56 , H04J1/04
Abstract: An acoustic wave resonator includes: a piezoelectric substrate; and an interdigital transducer (IDT) located on the piezoelectric substrate, the IDT including a pair of comb-shaped electrodes having a plurality of electrode fingers and a bus bar to which the plurality of electrode fingers are coupled, the IDT having: a first region in which a pitch of electrode fingers is substantially constant; a second region in which a pitch of electrode fingers decreases at closer distances to an outer side; and a third region in which a pitch of electrode fingers increases at closer distances to an outer side, the second region being located outside the first region in an arrangement direction of the plurality of electrode fingers, and the third region being located outside the second region in the arrangement direction.
-
Patent Agency Ranking
公开(公告)号：US20160380615A1
公开(公告)日：2016-12-29
申请号：US15099320
申请日：2016-04-14
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Yuki ENDO
Abstract: A ladder-type filter includes: one or more series resonators connected in series between an input terminal and an output terminal; one or more parallel resonators connected in parallel between the input terminal and the output terminal; divided parallel resonators formed by serially dividing at least one parallel resonator of the one or more parallel resonators; and an inductor of which a first end is coupled to a first node located in a path from the input terminal to the output terminal through the one or more series resonators, and of which a second end is coupled to a second node located between the divided parallel resonators.
Abstract translation: 梯型滤波器包括：串联连接在输入端和输出端之间的一个或多个串联谐振器; 在输入端子和输出端子之间并联连接的一个或多个并联谐振器; 通过串联地划分所述一个或多个并联谐振器的至少一个并联谐振器而形成的分开的并联谐振器; 以及电感器，其第一端耦合到位于通过所述一个或多个串联谐振器从所述输入端子到所述输出端子的路径中的第一节点，并且其中第二端耦合到位于所述分开的所述第二节点之间的第二节点 并联谐振器。
-
公开(公告)号：US20160359470A1
公开(公告)日：2016-12-08
申请号：US15166631
申请日：2016-05-27
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Eiji KUWAHARA , Yuki ENDO
CPC classification number: H03H9/542 , H03H7/1775 , H03H7/1783 , H03H9/0566 , H03H9/568 , H03H9/605 , H03H9/6483 , H03H9/706 , H03H9/725
Abstract: A ladder-type filter includes: one or more series resonators connected in series between an input terminal and an output terminal; two or more parallel resonators connected in parallel between the input terminal and the output terminal; a first inductor connected in series between at least two nodes, each of the at least two nodes being located between a corresponding parallel resonator of at least two parallel resonators of the two or more parallel resonators and ground; and a first capacitor connected in series with the first inductor between the at least two nodes.
Abstract translation: 梯型滤波器包括：串联连接在输入端和输出端之间的一个或多个串联谐振器; 在输入端子和输出端子之间并联连接的两个或更多个并联谐振器; 串联连接在至少两个节点之间的第一电感器，所述至少两个节点中的每一个位于两个或更多个并联谐振器的至少两个并联谐振器的对应并联谐振器和地之间; 以及在所述至少两个节点之间与所述第一电感器串联连接的第一电容器。
-
公开(公告)号：US20190081019A1
公开(公告)日：2019-03-14
申请号：US16103443
申请日：2018-08-14
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Motoi YAMAUCHI , Yuki ENDO
IPC: H01L23/00 , H01L25/065 , H01L23/66
Abstract: An electronic component includes: four device chips having rectangular planar shapes and arranged on a substrate so that a corner of four corners constituting a rectangle of one device chip is adjacent to the corners of remaining three device chips; first pads located on surfaces of the four device chips and closest to the corner; one or more first bumps bonding the first pads to the substrate in the four device chips; second pads located on surfaces of the four device chips, the second pad being one of pads other than the first pad; and one or more second bumps bonding the second pads to the substrate in the four device chips, a sum of bonded areas between the one or more second bumps and the second pad being less than a sum of bonded areas between the first pad and the one or more first bumps.
-
公开(公告)号：US20180041194A1
公开(公告)日：2018-02-08
申请号：US15646431
申请日：2017-07-11
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Masato ITO , Yuki ENDO , Ryo MIYAMOTO
Abstract: A multiplexer includes: a first filter that includes a piezoelectric thin film resonator and is connected between a common terminal and a first terminal, the piezoelectric thin film resonator being located on a substrate; a second filter that includes an acoustic wave resonator and is connected between the common terminal and a second terminal, the acoustic wave resonator including an IDT located on a piezoelectric substrate; and a capacitor that includes a pair of electrodes facing each other in a planar direction and is coupled to the first filter, the pair of electrodes being located on the piezoelectric substrate.
-
公开(公告)号：US20170272115A1
公开(公告)日：2017-09-21
申请号：US15610296
申请日：2017-05-31
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI , Yuki ENDO , Nobuaki MATSUO
CPC classification number: H04B1/44 , H04B1/0057 , H04B1/0064 , H04B15/02
Abstract: A module comprising: a first transmit filter that passes a transmission signal of a first band; a first receive filter that passes a reception signal of the first band; a second transmit filter that passes a transmission signal of a second band; a second receive filter that passes a reception signal of the second band; a third transmit filter that passes a transmission signal of a third band; and a third receive filter that passes a reception signal of the third band, wherein a transmit band of the first band overlaps with at least a part of a receive band of the second band, a receive band of the third band does not overlap with the transmit band of the first band or a transmit band of the second band, and the third receive filter is located between the first receive filter and the second receive filter.
-
-
-
-
-
Search Results
6
records
(took 0.015 seconds)
