公开(公告)号：US20210288628A1

公开(公告)日：2021-09-16

申请号：US17184910

申请日：2021-02-25

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Takuya NISHIMURA ,  Toshiharu NAKAZATO ,  Toshio NISHIZAWA ,  Naoki TAKAHASHI

IPC: H03H9/02 ,  H03H9/145 ,  H03H9/64

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer located over the support substrate, a pair of comb-shaped electrodes disposed on the piezoelectric layer and including electrode fingers exciting an acoustic wave, a temperature compensation film interposed between the support substrate and the piezoelectric layer, having a thickness equal to or less than 2 times an average pitch of the electrode fingers, and having a temperature coefficient of elastic constant opposite in sign to that of the piezoelectric layer, and a boundary layer interposed between the support substrate and the temperature compensation film and having a thickness equal to or greater than 2.2 times the average pitch, an acoustic velocity of a lateral wave propagating through the boundary layer being less than that of a lateral wave propagating through the support substrate and greater than that of a lateral wave propagating through the temperature compensation film.

公开(公告)号：US20180294402A1

公开(公告)日：2018-10-11

申请号：US15922685

申请日：2018-03-15

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Hikaru SHIMOMURA ,  Naoki TAKAHASHI ,  Yuki ENDO ,  Kota OKUBO

IPC: H01L41/09 ,  H01L41/047 ,  H03H9/56 ,  H04J1/04

Abstract: An acoustic wave resonator includes: a piezoelectric substrate; and an interdigital transducer (IDT) located on the piezoelectric substrate, the IDT including a pair of comb-shaped electrodes having a plurality of electrode fingers and a bus bar to which the plurality of electrode fingers are coupled, the IDT having: a first region in which a pitch of electrode fingers is substantially constant; a second region in which a pitch of electrode fingers decreases at closer distances to an outer side; and a third region in which a pitch of electrode fingers increases at closer distances to an outer side, the second region being located outside the first region in an arrangement direction of the plurality of electrode fingers, and the third region being located outside the second region in the arrangement direction.

公开(公告)号：US20180115300A1

公开(公告)日：2018-04-26

申请号：US15784477

申请日：2017-10-16

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Takuya KANEKO ,  Naoki TAKAHASHI

IPC: H03H9/02 ,  H03H9/25 ,  H03H9/64

CPC classification number: H03H9/02834 ,  H03H9/02559 ,  H03H9/25 ,  H03H9/6483

Abstract: A filter includes: parallel resonators connected in parallel between input and output terminals; series resonators connected in series between the input and output terminals; nodes at which the parallel resonators connect to a series pathway between the input and output terminals; first and second resonators included in the series resonators and connected in series in a first section of sections each being the series pathway between adjacent nodes of the nodes, the input terminal, and the output terminal, a difference in antiresonant frequency between the first and second resonators being a first difference; and third and fourth resonators included in the series resonators and connected in series in a second section of the sections, a difference in antiresonant frequency between the third and fourth resonators being a second difference, a third difference in antiresonant frequency between the first and third resonators being less than the first and second differences.

公开(公告)号：US20160365844A1

公开(公告)日：2016-12-15

申请号：US15084229

申请日：2016-03-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoyuki MIYAKE ,  Naoki TAKAHASHI

IPC: H03H9/64 ,  H03H9/54

CPC classification number: H03H9/706 ,  H03H9/542 ,  H03H9/568 ,  H03H9/605 ,  H03H9/6483 ,  H03H9/725

Abstract: A ladder-type filter includes: one or more series resonators connected in series between an input terminal and an output terminal; two or more parallel resonators connected in parallel between the input terminal and the output terminal; and a path that electrically connects ground terminals of the two or more parallel resonators to each other, electrically connects to ground through only a ground terminal of a parallel resonator located closest to the input terminal or to the output terminal, and includes at least two inductors connected in series in at least two positions of positions between the ground terminals of the two or more parallel resonators and a position between the ground terminal of the parallel resonator located closest to the input terminal or to the output terminal and the ground.

Abstract translation: 梯型滤波器包括：串联连接在输入端和输出端之间的一个或多个串联谐振器; 在输入端子和输出端子之间并联连接的两个或更多个并联谐振器; 以及将两个或更多个并联谐振器的接地端子彼此电连接的路径，仅通过位于最靠近输入端子或输出端子的并联谐振器的接地端子电连接到地，并且包括至少两个电感器 在两个或更多个并联谐振器的接地端子之间的位置中的至少两个位置和位于最接近输入端子的并联谐振器的接地端子之间的位置，或串联连接到输出端子和接地。

公开(公告)号：US20180131348A1

公开(公告)日：2018-05-10

申请号：US15787496

申请日：2017-10-18

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Naoki TAKAHASHI

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

CPC classification number: H03H9/6483 ,  H03H9/02992 ,  H03H9/1457 ,  H03H9/25 ,  H03H9/6489 ,  H03H9/725

Abstract: A filter includes: a piezoelectric substrate; input and output pads located on the piezoelectric substrate; a series resonator located in a region sandwiched between the input and output pads and located on the piezoelectric substrate and electrically connected in series between the input and output pads; a parallel resonator located in the region and electrically connected in parallel between the input and output pads; a longitudinally coupled acoustic wave resonator located on the piezoelectric substrate and located at a side, at which one pad of the input and output pads is located, with respect to the region; a first wiring line located on the piezoelectric substrate and connecting the one pad to the longitudinally coupled acoustic wave resonator; a second wiring line located on the piezoelectric substrate and connecting another pad of the input and output pads to the longitudinally coupled acoustic wave resonator; and a separation part located in one of the first and second wiring lines and separating the one of the first and second wiring lines into first and second parts in a planar direction, a distance between the first and second parts being greater than a shortest distance among distances between the first and second wiring lines and the series resonator and the parallel resonator.

公开(公告)号：US20220038071A1

公开(公告)日：2022-02-03

申请号：US17364462

申请日：2021-06-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Toshiharu NAKAZATO ,  Shinji YAMAMOTO ,  Ryouta IWABUCHI ,  Naoki TAKAHASHI

IPC: H03H9/02 ,  H03H9/64 ,  H03H9/145

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided over the support substrate, comb-shaped electrodes disposed on the piezoelectric layer, each of the comb-shaped electrodes including electrode fingers exciting an acoustic wave, a temperature compensation film interposed between the support substrate and the piezoelectric layer and having a temperature coefficient of an elastic constant opposite in sign to that of the piezoelectric layer, a boundary layer interposed between the support substrate and the temperature compensation film, an acoustic velocity of a bulk wave propagating through the boundary layer being higher than an acoustic velocity of a bulk wave propagating through the temperature compensation film and being lower than an acoustic velocity of a bulk wave propagating through the support substrate, and an intermediate layer interposed between the support substrate and the boundary layer and having a Q factor less than a Q factor of the boundary layer.

公开(公告)号：US20170370791A1

公开(公告)日：2017-12-28

申请号：US15615012

申请日：2017-06-06

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kentaro NAKAMURA ,  Fumiya MATSUKURA ,  Naoki TAKAHASHI ,  Takashi MATSUDA ,  Tsutomu MIYASHITA

IPC: G01L9/00 ,  H01L41/08 ,  G01L1/16 ,  H03H3/08 ,  H03H9/145 ,  H03H9/02

Abstract: An acoustic wave device fabrication method includes: forming on a piezoelectric substrate a comb-shaped electrode and a wiring layer coupled to the comb-shaped electrode; forming on the piezoelectric substrate a first dielectric film having a film thickness greater than those of the comb-shaped electrode and the wiring layer, covering the comb-shaped electrode and the wiring layer, and being made of silicon oxide doped with an element or undoped silicon oxide; forming on the first dielectric film a second dielectric film having an aperture above the wiring layer; removing the first dielectric film exposed by the aperture of the second dielectric film by wet etching using an etching liquid causing an etching rate of the second dielectric film to be less than that of the first dielectric film so that the first dielectric film is left so as to cover an end face of the wiring layer and the comb-shaped electrode.

公开(公告)号：US20170063337A1

公开(公告)日：2017-03-02

申请号：US15168554

申请日：2016-05-31

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Hiroshi HARA ,  Yasuhisa OKAMOTO ,  Naoki TAKAHASHI

IPC: H03H9/64 ,  H03H9/05 ,  H03H9/54 ,  H03H9/205

CPC classification number: H03H9/6483 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/6433 ,  H03H9/6479 ,  H03H9/703 ,  H03H9/72

Abstract: A multiplexer includes: one or more transmit filters that are connected between an antenna terminal and one or more transmit terminals; one or more receive filters that are connected between the antenna terminal and one or more receive terminals; and a circuit that includes a longitudinally coupled acoustic wave filter and is connected in parallel to one or more series resonators of a first filter that is one of the one or more transmit filters and the one or more receive filters and includes the one or more series resonators and one or more parallel resonators each formed of a piezoelectric thin film resonator, wherein the longitudinally coupled acoustic wave filter is formed of IDTs formed on a chip of a second filter that is another one of the one or more transmit filters and the one or more receive filters and formed of a surface acoustic wave resonator.

Abstract translation: 多路复用器包括：连接在天线端子和一个或多个发射端之间的一个或多个发射滤波器; 连接在天线端子与一个或多个接收端子之间的一个或多个接收滤波器; 以及电路，其包括纵向耦合的声波滤波器并且并联连接到作为所述一个或多个发射滤波器和所述一个或多个接收滤波器之一的第一滤波器的一个或多个串联谐振器，并且包括所述一个或多个串联 谐振器和一个或多个平行谐振器，每个谐振器由压电薄膜谐振器形成，其中纵向耦合的声波滤波器由形成在作为一个或多个发射滤波器中的另一个的第二滤波器的芯片上形成的IDT形成， 更多的接收滤波器并由声表面波谐振器形成。

公开(公告)号：US20150295697A1

公开(公告)日：2015-10-15

申请号：US14660329

申请日：2015-03-17

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Osamu KAWACHI ,  Naoki TAKAHASHI

IPC: H04L5/14 ,  H03H9/25 ,  H03H9/64 ,  H03H9/17

CPC classification number: H03H9/725 ,  H03H9/02574 ,  H03H9/605 ,  H03H9/6483 ,  H03H9/706 ,  H04B1/50 ,  H04J1/12 ,  H04L5/14

Abstract: A multiplexer includes: a first chip that has a first filter and a resonator, the first filter being connected between a common terminal and a first terminal, a first end of the resonator being connected to the common terminal not via the first filter; and a second chip that has a second filter, the second filter being connected between a second end of the resonator and a second terminal and having a pass band lower than that of the first filter, a resonance frequency of the resonator being higher than the pass band of the second filter.

Abstract translation: 多路复用器包括：具有第一滤波器和谐振器的第一芯片，所述第一滤波器连接在公共端子和第一端子之间，所述谐振器的第一端不经由所述第一滤波器连接到所述公共端子; 以及具有第二滤波器的第二芯片，所述第二滤波器连接在所述谐振器的第二端和第二端子之间，并且具有低于所述第一滤波器的通带的通带，所述谐振器的谐振频率高于所述谐振器的谐振频率 第二过滤器的带。