Electronic component
    2.
    发明授权

    公开(公告)号:US10575404B2

    公开(公告)日:2020-02-25

    申请号:US16134733

    申请日:2018-09-18

    Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

    Piezoelectric device
    3.
    发明授权

    公开(公告)号:US09762203B2

    公开(公告)日:2017-09-12

    申请号:US14596696

    申请日:2015-01-14

    CPC classification number: H03H9/1021 H01L41/053 H01L2924/16195

    Abstract: A piezoelectric device has: a ceramic substrate having a first principal surface and a second principal surface opposed to each other; a piezoelectric element arranged on the first principal surface; a frame having a first face and a second face opposed to each other and arranged on the ceramic substrate so as to surround the piezoelectric element; a metal layer arranged on the second face of the frame; and a metal lid arranged on the metal layer so as to close a space surrounded by the frame. The first face of the frame is in contact with the first principal surface of the ceramic substrate. The metal layer and the metal lid are joined to each other by resistance welding. The frame has a composite portion containing a metal and a metal oxide and the composite portion includes the second face and is in contact with the metal layer.

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