公开(公告)号：US20230215618A1

公开(公告)日：2023-07-06

申请号：US18119473

申请日：2023-03-09

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H05K1/18 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F41/041 ,  H05K1/181 ,  H01F27/2804 ,  H01F2017/048

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20200373077A1

公开(公告)日：2020-11-26

申请号：US16877831

申请日：2020-05-19

Applicant: TDK CORPORATION

Inventor： Kenei ONUMA ,  Masazumi ARATA ,  Hitoshi OHKUBO

IPC: H01F27/32 ,  H01F27/28

Abstract: An upper end portion and a lower end portion of a second magnetic portion of a coil component are further away from a coil than when a third part and a fifth part are not present. For this reason, a magnetic flux is unlikely to be concentrated in the upper end portion and the lower end portion of the second magnetic portion, so that magnetic saturation is unlikely to occur. Therefore, improvement of direct current superimposition characteristics is realized in the coil component.

公开(公告)号：US20200303116A1

公开(公告)日：2020-09-24

申请号：US16811610

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/28 ,  H01F41/04 ,  H05K1/18

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20240331926A1

公开(公告)日：2024-10-03

申请号：US18618214

申请日：2024-03-27

Applicant: TDK Corporation

Inventor： Manabu OHTA ,  Ryo FUKUOKA ,  Yuji MATSUURA ,  Hokuto EDA ,  Takahiro NEMOTO ,  Kenei ONUMA ,  Masazumi ARATA ,  Hitoshi OHKUBO

IPC: H01F27/29 ,  H01F5/04

CPC classification number: H01F27/29 ,  H01F5/04

Abstract: In the coil component, the lower end portion of the bump electrode protruding from the lower surface of the element body includes a flange portion, and the lower surface of the lower end portion is concave-convex. Therefore, compared to the case where the bump electrode is exposed in the form of a flat surface so as to be flat with the lower surface of the element body, the contact areas between the bump electrodes and the terminal electrodes are increased, and high connection reliability between the bump electrodes and the terminal electrodes is realized.

公开(公告)号：US20230215617A1

公开(公告)日：2023-07-06

申请号：US18119457

申请日：2023-03-09

Applicant: TDK CORPORATION

Inventor： Takahiro KAWAHARA ,  Manabu OHTA ,  Kenei ONUMA ,  Yuuya KANAME ,  Ryo FUKUOKA ,  Hokuto EDA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H05K1/18 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F41/041 ,  H05K1/181 ,  H01F27/2804 ,  H01F2017/048

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

公开(公告)号：US20230066655A1

公开(公告)日：2023-03-02

申请号：US17892939

申请日：2022-08-22

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Manabu OHTA ,  Kenei ONUMA

IPC: H01F27/29 ,  H01F27/32

Abstract: In the coil component, since the contact area between the external terminal electrode and the element body is increased by the protrusion of the external terminal electrode, the external terminal electrode and the element body are more closely attached to each other. Therefore, the attachment strength between the external terminal electrode and the element body can be improved. Hence, it is possible to suppress peeling of the external terminal electrode from the element body.

公开(公告)号：US20220415566A1

公开(公告)日：2022-12-29

申请号：US17845003

申请日：2022-06-21

Applicant: TDK CORPORATION

Inventor： Hokuto EDA ,  Hitoshi OHKUBO ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI ,  Takamasa IWASAKI ,  Manabu OHTA ,  Kenei ONUMA

IPC: H01F27/29 ,  H01F27/255

Abstract: An electronic component preventing peeling of an external terminal is provided. Since each of the external terminal electrodes on the upper face has a U-shaped outline, stress concentration is less likely to occur at an inner end portion than in the external terminal electrode having a corner at the inner end portion. Therefore, for example, even when an impact is applied, a situation in which the external terminal electrode peels off from the upper face due to stress concentration is prevented.

公开(公告)号：US20210151248A1

公开(公告)日：2021-05-20

申请号：US17094433

申请日：2020-11-10

Applicant: TDK CORPORATION

Inventor： Hitoshi OHKUBO ,  Kenei ONUMA ,  Masazumi ARATA ,  Masataro SAITO ,  Kohei TAKAHASHI

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/29

Abstract: In a coil component, a main body portion is made of a metal magnetic powder-containing resin, and thus a resin component appears on end surfaces of the main body portion. In addition, since external terminal electrodes are made of a conductive resin, a resin component also appears on the surfaces of the external terminal electrodes. Accordingly, insulating coating layers are integrally covered with high adhesion with the end surfaces of the main body portion and the external terminal electrodes by the insulating coating layers coming into contact with the end surfaces of the main body portion so as to straddle the external terminal electrodes.