COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20180323003A1

    公开(公告)日:2018-11-08

    申请号:US15961101

    申请日:2018-04-24

    CPC classification number: H01F27/292 H01F27/2804 H01F27/323 H01F2027/2809

    Abstract: Disclosed herein is a coil component that includes a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, and an external terminal. Each of the conductor layers has a coil conductor pattern and an electrode pattern exposed from the coil part. The electrode patterns are connected to each other through a plurality of via conductors penetrating the interlayer insulating layers. At least one of the interlayer insulating layers is exposed from the coil part positioned between the plurality of electrode patterns. The external terminal is formed on the electrode patterns exposed from the coil part so as to avoid an exposed part of the interlayer insulating layer.

    COIL COMPONENT
    2.
    发明申请

    公开(公告)号:US20220102043A1

    公开(公告)日:2022-03-31

    申请号:US17486196

    申请日:2021-09-27

    Abstract: Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20230245813A1

    公开(公告)日:2023-08-03

    申请号:US18160446

    申请日:2023-01-27

    Abstract: Disclosed herein is a coil component that includes conductor layers embedded in a base and terminal electrodes embedded in the base. Each of the terminal electrodes is exposed to a mounting surface of the base and a respective corner portion of the base. The conductor layers include connection patterns each connected to an associated one of the terminal electrodes. The first connection pattern is exposed to the third side surface without being exposed to the first side surface, the second connection pattern is exposed to the fourth side surface without being exposed to the first side surface, the third connection pattern is exposed to the third side surface without being exposed to the second side surface, and the fourth connection pattern is exposed to the fourth side surface without being exposed to the second side surface.

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20190035534A1

    公开(公告)日:2019-01-31

    申请号:US16046586

    申请日:2018-07-26

    Abstract: A coil component includes a plurality of conductor layers constituted of a first conductor layer to a fourth conductor layer that includes a function layer and a coil layer wound around an axis center; and a covering portion that is formed of an insulative resin, integrally covers the plurality of conductor layers, and is interposed between conductor layers adjacent to each other. The coil layer and the function layer of the plurality of conductor layers have substantially the same shape in a plan view. The fourth conductor layer has a connection conductor layer connecting the coil layer and the function layer to each other. A conductor layer having no connection conductor layer among the plurality of conductor layers has a protrusion portion corresponding to the connection conductor layer at a position overlapping the connection conductor layer in a plan view.

    COMMON MODE FILTER
    8.
    发明公开
    COMMON MODE FILTER 审中-公开

    公开(公告)号:US20230253141A1

    公开(公告)日:2023-08-10

    申请号:US18163500

    申请日:2023-02-02

    CPC classification number: H01F27/2804 H01F27/292 H03H7/0153 H01F2027/2809

    Abstract: Disclosed herein is a common mode filter that includes: a first conductor layer including a first coil pattern, a first connection pattern, and a first lead-out pattern connecting the first coil pattern and the first connection pattern; and a second conductor layer including a second coil pattern, a second connection pattern, and a second lead-out pattern connecting the second coil pattern and the second connection pattern. The extending direction of the first section of the first lead-out pattern and an extending direction of the second section of the second lead-out pattern are opposed to each other. The first section is longer than the second section. The second coil pattern is larger in diameter than the first coil pattern.

    COIL COMPONENT
    10.
    发明申请

    公开(公告)号:US20220102044A1

    公开(公告)日:2022-03-31

    申请号:US17486264

    申请日:2021-09-27

    Abstract: Disclosed herein is a coil component that includes a plurality of conductor layers including first, second, third, and fourth conductor layers stacked one on another in this order. First and third planar spiral coils are formed in the first and third conductor layers. A second planar spiral coil is formed in the second and fourth conductor layers. A pattern width of the second planar spiral coil formed in the second conductor layer is smaller than that of the second planar spiral coil formed in the fourth conductor layer, or a pattern width of each of the first and third planar spiral coils formed in the third conductor layer is smaller than that of each of the first and third planar spiral coils formed in the first conductor layer.

Patent Agency Ranking