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    COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220189679A1

    公开(公告)日：2022-06-16

    申请号：US17545607

    申请日：2021-12-08

    Applicant: TDK CORPORATION

    Inventor： Ryo FUKUOKA ,  Hironori KIMATA ,  Masataro SAITO ,  Masazumi ARATA ,  Hitoshi OHKUBO

    IPC: H01F27/28 ,  H01F27/32

    Abstract: In the coil component, the maximum reference surface height of the entire wall of the outermost wall and the innermost wall is the same as the reference surface height of the winding part of the coil, that is, equal to or less than the reference surface height of the winding part of the coil. In addition, in both the outermost wall and the innermost wall, the reference surface height of the second side surface is lower than the reference surface height of the winding part of the coil. In this case, in the vicinity of the upper surface of the outermost wall and the innermost wall, the magnetic flux toward the main surface side of the substrate is suppressed from being blocked by the outermost wall and the innermost wall, and the magnetic flux circulation is improved. Thus, the coil characteristics of the coil component are improved.

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210151234A1

    公开(公告)日：2021-05-20

    申请号：US17093808

    申请日：2020-11-10

    Applicant: TDK CORPORATION

    Inventor： Hitoshi OHKUBO ,  Manabu OHTA ,  Ryo FUKUOKA ,  Hironori KIMATA

    IPC: H01F17/04 ,  H01F27/28

    Abstract: In a coil component, a height h1 of a pedestal portion of a resin wall corresponds to the height position of a step portion. In addition, a height of a seed portion corresponds to the plating start position at a time when a winding portion of a coil is plated and grown. The plating start position and the step portion are designed to be close to each other by the height h1 of the pedestal portion and the height h2 of the seed portion satisfying 0.3≤h1/h2≤10. Accordingly, although the coil component has a configuration in which the resin wall has the step portion, the inside of the step portion is sufficiently filled with a coil conductor, and thus deterioration of characteristics is suppressed.

    COIL COMPONENT
    6.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20240331926A1

    公开(公告)日：2024-10-03

    申请号：US18618214

    申请日：2024-03-27

    Applicant: TDK Corporation

    Inventor： Manabu OHTA ,  Ryo FUKUOKA ,  Yuji MATSUURA ,  Hokuto EDA ,  Takahiro NEMOTO ,  Kenei ONUMA ,  Masazumi ARATA ,  Hitoshi OHKUBO

    IPC: H01F27/29 ,  H01F5/04

    CPC classification number: H01F27/29 ,  H01F5/04

    Abstract: In the coil component, the lower end portion of the bump electrode protruding from the lower surface of the element body includes a flange portion, and the lower surface of the lower end portion is concave-convex. Therefore, compared to the case where the bump electrode is exposed in the form of a flat surface so as to be flat with the lower surface of the element body, the contact areas between the bump electrodes and the terminal electrodes are increased, and high connection reliability between the bump electrodes and the terminal electrodes is realized.

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