PLATING DEVICE
    1.
    发明申请
    PLATING DEVICE 审中-公开
    电镀设备

    公开(公告)号:US20160201213A1

    公开(公告)日:2016-07-14

    申请号:US14980610

    申请日:2015-12-28

    CPC classification number: C25D21/06 C25D17/02 C25D21/18 C25D21/22

    Abstract: A plating device equipped with a plating tank and an impurity removal mechanism disposed so as to remove impurities from a plating solution in the plating tank or a plating solution to be supplied to the plating tank, in which the impurity removal mechanism includes at least one of a carboxylic acid removal mechanism and an alcohol removal mechanism.

    Abstract translation: 一种电镀装置,其具有电镀槽和杂质去除机构,其被配置为从电镀槽中的电镀液或电镀槽中提供的镀液中除去杂质,其中杂质去除机构包括以下的至少一种: 羧酸去除机理和醇去除机理。

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