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    COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220102043A1

    公开(公告)日：2022-03-31

    申请号：US17486196

    申请日：2021-09-27

    Applicant: TDK Corporation

    Inventor： Hidenori TSUTSUI ,  Kouji KAWAMURA ,  Hiromu SAKAMOTO ,  Kengo OSADA ,  Takuro TSURUTA ,  Takeshi OKUMURA

    IPC: H01F17/00 ,  H01F27/29

    Abstract: Disclosed herein is a coil component that includes first, second, third, and fourth terminal electrodes; a first planar spiral coil formed on a substrate, the first planar spiral coil having an outer peripheral end connected to the first terminal electrode; a second planar spiral coil stacked on the first planar spiral coil through a first insulating layer, the second planar spiral coil having an outer peripheral end connected to the second terminal electrode; and first and second lead-out patterns stacked on the second planar spiral coil through a second insulating layer. The first lead-out pattern connects the third terminal electrode and an inner peripheral end of the first planar spiral coil. The second lead-out pattern connects the fourth terminal electrode and an inner peripheral end of the second planar spiral coil. The second insulating layer is thicker than the first insulating layer.

    ELECTRONIC COMPONENT
    2.
    发明公开
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230245813A1

    公开(公告)日：2023-08-03

    申请号：US18160446

    申请日：2023-01-27

    Applicant: TDK Corporation

    Inventor： Takeshi OKUMURA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Yosuke MIZUTANI ,  Hiroyuki NISHIOKA

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/06 ,  H01F41/04

    CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/06 ,  H01F41/041 ,  H01F2027/2809

    Abstract: Disclosed herein is a coil component that includes conductor layers embedded in a base and terminal electrodes embedded in the base. Each of the terminal electrodes is exposed to a mounting surface of the base and a respective corner portion of the base. The conductor layers include connection patterns each connected to an associated one of the terminal electrodes. The first connection pattern is exposed to the third side surface without being exposed to the first side surface, the second connection pattern is exposed to the fourth side surface without being exposed to the first side surface, the third connection pattern is exposed to the third side surface without being exposed to the second side surface, and the fourth connection pattern is exposed to the fourth side surface without being exposed to the second side surface.

    COMMON MODE FILTER
    5.
    发明公开
    COMMON MODE FILTER 审中-公开

    公开(公告)号：US20230253141A1

    公开(公告)日：2023-08-10

    申请号：US18163500

    申请日：2023-02-02

    Applicant: TDK Corporation

    Inventor： Takeshi OKUMURA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Hiroshi SAGAWA ,  Kenichi ICHINOSE ,  Taichi HIROSE ,  Hiromu SAKAMOTO

    IPC: H01F27/28 ,  H01F27/29 ,  H03H7/01

    CPC classification number: H01F27/2804 ,  H01F27/292 ,  H03H7/0153 ,  H01F2027/2809

    Abstract: Disclosed herein is a common mode filter that includes: a first conductor layer including a first coil pattern, a first connection pattern, and a first lead-out pattern connecting the first coil pattern and the first connection pattern; and a second conductor layer including a second coil pattern, a second connection pattern, and a second lead-out pattern connecting the second coil pattern and the second connection pattern. The extending direction of the first section of the first lead-out pattern and an extending direction of the second section of the second lead-out pattern are opposed to each other. The first section is longer than the second section. The second coil pattern is larger in diameter than the first coil pattern.

    COIL COMPONENT
    7.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220102044A1

    公开(公告)日：2022-03-31

    申请号：US17486264

    申请日：2021-09-27

    Applicant: TDK Corporation

    Inventor： Takeshi OKUMURA ,  Kouji KAWAMURA ,  Hidenori TSUTSUI ,  Kenichi ICHINOSE ,  Taichi HIROSE ,  Mitsuo NATORI ,  Kyohei YAZAKI ,  Shouji SHIMADA

    IPC: H01F17/00 ,  H01F27/29

    Abstract: Disclosed herein is a coil component that includes a plurality of conductor layers including first, second, third, and fourth conductor layers stacked one on another in this order. First and third planar spiral coils are formed in the first and third conductor layers. A second planar spiral coil is formed in the second and fourth conductor layers. A pattern width of the second planar spiral coil formed in the second conductor layer is smaller than that of the second planar spiral coil formed in the fourth conductor layer, or a pattern width of each of the first and third planar spiral coils formed in the third conductor layer is smaller than that of each of the first and third planar spiral coils formed in the first conductor layer.

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