公开(公告)号：US10096527B2

公开(公告)日：2018-10-09

申请号：US15242376

申请日：2016-08-19

Applicant: TEL Epion Inc.

Inventor： Joshua LaRose ,  Brian D. Pfeifer ,  Vincent Lagana-Gizzo ,  Noel Russell

IPC: H01L21/66 ,  H01J37/32 ,  H01L21/3065 ,  G05B19/418

Abstract: A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

公开(公告)号：US20190043766A1

公开(公告)日：2019-02-07

申请号：US16154025

申请日：2018-10-08

Applicant: TEL Epion Inc.

Inventor： Joshua LaRose ,  Brian D. Pfeifer ,  Vincent Lagana-Gizzo ,  Noel Russell

IPC: H01L21/66 ,  H01J37/32 ,  G05B19/418 ,  H01L21/3065

Abstract: A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

公开(公告)号：US20170053843A1

公开(公告)日：2017-02-23

申请号：US15242376

申请日：2016-08-19

Applicant: TEL Epion Inc.

Inventor： Joshua LaRose ,  Brian D. Pfeifer ,  Vincent Lagana-Gizzo ,  Noel Russell

IPC: H01L21/66 ,  G05B23/02 ,  G05B19/19 ,  G05B19/406 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01L22/20 ,  G05B19/41875 ,  G05B2219/32216 ,  H01J37/32009 ,  H01J37/3244 ,  H01J37/32935 ,  H01J37/3299 ,  H01J2237/334 ,  H01L21/3065 ,  H01L22/12 ,  Y02P90/22

Abstract: A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.

Abstract translation: 描述用于对工件进行校正处理的系统和方法。 所述系统和方法包括从第一源接收第一组参数数据，所述第一组在诊断上与微电子工件的至少第一部分相关，以及从不同于诊断相关的第一源的第二源接收第二组参数数据 到微电子工件的至少第二部分。 此后，产生校正过程，并且通过使用第一组参数数据和第二组参数数据的组合将校正过程应用于目标区域来处理微电子工件的目标区域。

公开(公告)号：US10971411B2

公开(公告)日：2021-04-06

申请号：US16154025

申请日：2018-10-08

Applicant: TEL Epion Inc.

Inventor： Joshua LaRose ,  Brian D. Pfeifer ,  Vincent Lagana-Gizzo ,  Noel Russell

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/3065 ,  G05B19/418

Abstract: A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.