公开(公告)号：US11456262B2

公开(公告)日：2022-09-27

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, Jr. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US11495549B2

公开(公告)日：2022-11-08

申请号：US17185589

申请日：2021-02-25

Applicant: Texas Instruments Incorporated

Inventor： Naweed Anjum ,  Michael Gerald Amaro ,  Charles Allen Devries, Jr.

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/495

Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

公开(公告)号：US11798900B2

公开(公告)日：2023-10-24

申请号：US17806694

申请日：2022-06-13

Applicant: Texas Instruments Incorporated

Inventor： Naweed Anjum ,  Michael Gerald Amaro ,  Charles Allen Devries, Jr.

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/495 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49503 ,  H01L23/49534 ,  H01L23/49541 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10015

Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.