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公开(公告)号:US11646181B2
公开(公告)日:2023-05-09
申请号:US17376771
申请日:2021-07-15
发明人: Natsumi Torii , Koichi Nagami
IPC分类号: H01J37/32
CPC分类号: H01J37/32715 , H01J37/32183 , H01J37/32642 , H01J37/32935
摘要: A plasma processing apparatus includes: a chamber; a substrate support provided inside the chamber and including an electrode, an electrostatic chuck provided on the electrode, and an edge ring that is disposed on the electrostatic chuck while surrounding the substrate placed on the electrostatic chuck; a radio-frequency power supply that supplies radio-frequency power for generating plasma from a gas within the chamber; a DC power supply that applies a negative DC voltage to the edge ring; and a controller that controls the radio-frequency power and the DC voltage. The controller controls the apparatus to execute a process including: (a) stopping application of the DC voltage while stopping supply of the radio-frequency power; and (b) starting the application of the DC voltage after a predetermined delay time elapses since the supply of the radio-frequency power.
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公开(公告)号:US10727028B2
公开(公告)日:2020-07-28
申请号:US16304370
申请日:2017-05-17
发明人: Natsumi Torii
IPC分类号: H03H7/38 , H01J37/32 , H01L21/3065 , H03H11/28 , H01L21/67
摘要: Provided is a matching device capable of realizing a high-speed matching operation. A matching device of an embodiment includes a series part, a parallel part, and one or more variable direct-current power sources. The series part includes a first diode having a variable capacitance and is provided between an input terminal of a radio frequency wave and an output terminal of a radio frequency wave. The parallel part includes a second diode having a variable capacitance and is provided between a node between the input terminal and the output terminal and a ground. The one or more variable direct-current power sources are provided to apply variable reverse bias voltages to the first diode and the second diode.
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公开(公告)号:US10431433B2
公开(公告)日:2019-10-01
申请号:US16003954
申请日:2018-06-08
发明人: Koichi Nagami , Natsumi Torii
IPC分类号: H01J37/32
摘要: In a plasma processing apparatus, a controller controls one or both of a first high frequency power supply and a second high frequency power supply to periodically stop the supply of one or both of the first high frequency power and the second high frequency power. The controller also controls a switching unit to apply a DC voltage to a focus ring from a first time after a predetermined period of time in which a self-bias voltage of a lower electrode is decreased from a start point of each period in which one or both of the first high frequency power and the second high frequency power are supplied and to stop the application of the DC voltage to the focus ring during each period in which the supply of one or both of the first high frequency power and the second high frequency power is stopped.
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