公开(公告)号：US20220078921A1

公开(公告)日：2022-03-10

申请号：US17527352

申请日：2021-11-16

Applicant: TOPPAN INC.

Inventor： Yuki NITTA ,  Takeshi TAMURA ,  Masashi SAWADAISHI ,  Takashi FUJITA

IPC: H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/14 ,  H01L23/32 ,  H05K3/28 ,  H05K3/34 ,  H05K3/30

Abstract: There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.