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公开(公告)号：US20230395395A1
公开(公告)日：2023-12-07
申请号：US18207555
申请日：2023-06-08
Applicant: TOPPAN INC.
Inventor： Takashi KIZU , Akane KOBAYASHI , Yuki NITTA
CPC classification number: H01L21/4857 , H05K3/424 , H05K1/144 , H01L24/83 , H01L24/32 , H05K3/368 , H05K3/429 , H05K3/4682 , H01L24/16 , H01L24/73 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L23/49838 , H01L23/49894 , H01L21/4853 , H01L21/486 , H01L2224/32225 , H05K2203/0165 , H05K2203/107 , H01L2224/73204 , H01L2224/16227 , H01L2224/83203 , H01L2924/3511
Abstract: A board unit with support which does not require a high-energy UV laser and which is less likely to form residues of the release layer after separation of the support, a board unit, and a semiconductor device, and a method of producing them. The board unit with support includes a support, a release layer, a laser absorption layer that absorbs laser light, and at least one first wiring board in this order, wherein the at least one first wiring board has a first surface provided with first electrodes that can be bonded to at least one semiconductor element, the at least one first wiring board has a second surface provided with second electrodes that can be bonded to a second wiring board.
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公开(公告)号：US20220078921A1
公开(公告)日：2022-03-10
申请号：US17527352
申请日：2021-11-16
Applicant: TOPPAN INC.
Inventor： Yuki NITTA , Takeshi TAMURA , Masashi SAWADAISHI , Takashi FUJITA
Abstract: There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.
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