公开(公告)号：US20200286990A1

公开(公告)日：2020-09-10

申请号：US16510488

申请日：2019-07-12

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhiro UCHIYAMA ,  Shinya ARAI ,  Koichi SAKATA ,  Takahiro TOMIMATSU

IPC: H01L29/06 ,  H01L21/762 ,  H01L21/761

Abstract: A semiconductor device including a first chip and a second chip. The first chip includes: a first substrate; a first transistor that is provided on the first substrate; and a first pad that is provided above the first transistor and that is electrically connected to the first transistor. The second chip includes: a second pad that is provided on the first pad; a second substrate that is provided above the second pad and that includes a first diffusion layer and a second diffusion layer, at least one of the first diffusion layer and the second diffusion layer being electrically connected to the second pad; and an isolation insulating film or an isolation trench that extends at least from an upper surface of the second substrate to a lower surface of the second substrate within the second substrate and that isolates the first diffusion layer from the second diffusion layer.

公开(公告)号：US20200295027A1

公开(公告)日：2020-09-17

申请号：US16555418

申请日：2019-08-29

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Koichi SAKATA ,  Kazutaka SUZUKI ,  Hiroaki ASHIDATE ,  Katsuhiro SATO ,  Satoshi NAKAOKA

IPC: H01L27/11578 ,  H01L27/11573 ,  H01L27/11565

Abstract: A semiconductor storage device includes a first stacked body, a second stacked body, a first division film, a second division film, and a plurality of discrete films. The a first stacked body includes first electrode layers stacked in a first direction. The second stacked body, above the first stacked body, includes second electrode layers stacked in the first direction. The second semiconductor layer is electrically connected to the first semiconductor layer. The first division film, extending in the first direction through the first stacked body, divides the first stacked body in a second direction crossing the first direction. The second division film, extending in the first direction through the second stacked body, divides the second stacked body in the second direction. The discrete films, extending in the first direction through the second stacked body, are disposed above the first division film.