SEMICONDUCTOR PROCESSING DEVICE
    1.
    发明申请

    公开(公告)号:US20190259639A1

    公开(公告)日:2019-08-22

    申请号:US16045786

    申请日:2018-07-26

    Abstract: A semiconductor processing device according to an embodiment includes a processing tank configured to store a chemical therein to allow a semiconductor substrate to be immersed in the chemical. A gas supply part is provided below the semiconductor substrate accommodated in the processing tank and is configured to supply air bubbles to the chemical from below the semiconductor substrate. A chemical supply part is provided above the gas supply part and below the semiconductor substrate and is configured to discharge the chemical caused to circulate from the processing tank, towards the air bubbles appearing from the gas supply part.

    SUBSTRATE TREATMENT APPARATUS
    2.
    发明申请

    公开(公告)号:US20200273727A1

    公开(公告)日:2020-08-27

    申请号:US16542831

    申请日:2019-08-16

    Abstract: A substrate treatment apparatus according to an embodiment includes a treatment tank to store a chemical solution to treat a substrate, a pipe having a discharge port through which an air bubble is discharged from a bottom of the treatment tank toward the substrate, and a rod body disposed between the discharge port and the substrate to divide the air bubble.

    SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200295027A1

    公开(公告)日:2020-09-17

    申请号:US16555418

    申请日:2019-08-29

    Abstract: A semiconductor storage device includes a first stacked body, a second stacked body, a first division film, a second division film, and a plurality of discrete films. The a first stacked body includes first electrode layers stacked in a first direction. The second stacked body, above the first stacked body, includes second electrode layers stacked in the first direction. The second semiconductor layer is electrically connected to the first semiconductor layer. The first division film, extending in the first direction through the first stacked body, divides the first stacked body in a second direction crossing the first direction. The second division film, extending in the first direction through the second stacked body, divides the second stacked body in the second direction. The discrete films, extending in the first direction through the second stacked body, are disposed above the first division film.

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