公开(公告)号：US20230207670A1

公开(公告)日：2023-06-29

申请号：US18178140

申请日：2023-03-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Yao Lin ,  Pei-Hsiu Wu ,  Chih Ping Wang ,  Chih-Han Lin ,  Jr-Jung Lin ,  Yun Ting Chou ,  Chen-Yu Wu

IPC: H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L21/311 ,  H01L21/285

CPC classification number: H01L29/6681 ,  H01L29/7851 ,  H01L29/0649 ,  H01L29/66636 ,  H01L21/31111 ,  H01L21/31116 ,  H01L29/66545 ,  H01L21/28518

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

公开(公告)号：US20240371979A1

公开(公告)日：2024-11-07

申请号：US18774512

申请日：2024-07-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Yao Lin ,  Pei-Hsiu Wu ,  Chih Ping Wang ,  Chih-Han Lin ,  Jr-Jung Lin ,  Yun Ting Chou ,  Chen-Yu Wu

IPC: H01L29/66 ,  H01L21/285 ,  H01L21/311 ,  H01L29/06 ,  H01L29/78

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

公开(公告)号：US12113122B2

公开(公告)日：2024-10-08

申请号：US18178140

申请日：2023-03-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Yao Lin ,  Pei-Hsiu Wu ,  Chih Ping Wang ,  Chih-Han Lin ,  Jr-Jung Lin ,  Yun Ting Chou ,  Chen-Yu Wu

IPC: H01L29/66 ,  H01L21/285 ,  H01L21/311 ,  H01L29/06 ,  H01L29/78

CPC classification number: H01L29/6681 ,  H01L21/28518 ,  H01L21/31111 ,  H01L21/31116 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/7851

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

公开(公告)号：US11600717B2

公开(公告)日：2023-03-07

申请号：US17069460

申请日：2020-10-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Yao Lin ,  Pei-Hsiu Wu ,  Chih Ping Wang ,  Chih-Han Lin ,  Jr-Jung Lin ,  Yun Ting Chou ,  Chen-Yu Wu

IPC: H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L21/311 ,  H01L21/285

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.

公开(公告)号：US20210367059A1

公开(公告)日：2021-11-25

申请号：US17069460

申请日：2020-10-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Yao Lin ,  Pei-Hsiu Wu ,  Chih Ping Wang ,  Chih-Han Lin ,  Jr-Jung Lin ,  Yun Ting Chou ,  Chen-Yu Wu

IPC: H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L21/285 ,  H01L21/311

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.